G01B 2210/48
For measurement of a wafer
Official title: for measurement of a wafer
G01B2210/48 (For measurement of a wafer) appears on 38 US grants and 47 published applications in this corpus.
Search patents in G01B- Granted patents
- 38
- Published applications
- 47
- Assignees
- 26
- Inventors
- 109
- Latest grant
- 3 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 3 | 4 |
| 2016 | 0 | 0 |
| 2017 | 2 | 1 |
| 2018 | 2 | 4 |
| 2019 | 3 | 3 |
| 2020 | 3 | 10 |
| 2021 | 7 | 12 |
| 2022 | 7 | 1 |
| 2023 | 2 | 2 |
| 2024 | 1 | 4 |
| 2025 | 3 | 1 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer thickness measurement device and method for same3 Feb 2026US 12,540,813 B2Kobelco Research Institute, Inc.
- Angular averaging calibration on bare wafer metrology tools for ESFQR matching improvement20 Jan 2026US 12,529,552 B2KLA Corporation
- Measurement method and measurement apparatus for measuring thickness of semiconductor wafer11 Nov 2025US 12,467,741 B2santec Holdings Corporation
- Measurement method, imprint apparatus, and article manufacturing method30 Sep 2025US 12,429,764 B2Canon Kabushiki Kaisha
- System and method to map thickness variations of substrates in manufacturing systems15 Apr 2025US 12,276,490 B2APPLIED Materials.Inc.
- Contour shape measurement device and method for the same9 Apr 2026US 2026/0098721 A1Kobelco Research Institute, Inc.
- Substrate holder surface treatments providing corrosion resistance and wear resistance5 Feb 2026US 2026/0035777 A1APPLIED Materials.Inc.
- Systems and methods for quasi-doppler shift interferometer15 Jan 2026US 2026/0017781 A1
- System and method to map thickness variations of substrates in manufacturing systems10 Jul 2025US 2025/0224228 A1APPLIED Materials.Inc.
- Wafer thickness measurement device and method for same5 Dec 2024US 2024/0401931 A1Kobelco Research Institute, Inc.
Most cited
By later US patents
- Method and apparatus for separating fixture-induced error from measured object characteristics and for compensating the measured object characteristic with the error, and a bow/warp station implementing same74US 4,750,141 AADE Corporation · 1988
- Method for compensating for wafer shape measurement variation due to variation of environment temperature16US 8,949,057 B1KLA-Tencor Corporation · 2015
- Metrics for asymmetric wafer shape characterization4US 11,393,118 B2KLA Corporation · 2022
- Method and apparatus for moving an article relative to and between a pair of thickness measuring probes to develop a thickness map for the article4US 6,242,926 B1IPEC Precision, Inc. · 2001
- Internal crack detecting method and internal crack detecting apparatus3US 10,119,921 B2Disco Corporation · 2018