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US 11,393,118 B2Granted
Metrics for asymmetric wafer shape characterization
AssigneeKLA Corporation
InventorsShivam Agarwal, Priyank Jain, Yuan Zhong, Chiou Shoei Chee
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Abstract
Using data about the geometry of the wafer, the geometry of the wafer is measured along at least three diameters originating at different points along a circumference of the wafer. A characterization of the geometry of the wafer is determined using the three diameters. A probability of wafer clamping failure for the wafer can be determined based on the characterization.
Claims20
A detection system comprising:
- an imaging system configured to measure geometry of a wafer;
- and
- a processor in electronic communication with the imaging system, wherein the processor is configured to:
- obtain data about the geometry of the wafer;
- measure the geometry of the wafer along at least three diameters originating at different points along a circumference of the wafer;
- and
- determine a characterization of the geometry of the wafer using the three diameters.
4 more elements
A method comprising:
- receiving data about the geometry of the wafer at a processor;
- measuring, using the processor, the geometry of the wafer along at least three diameters originating at different points along a circumference of the wafer;
- and
- determining, using the processor, a characterization of the geometry of the wafer using the three diameters.
1 more element
Dependencies are inferred from the claim text.