F28D 15/046
Characterised by the material or the construction of the capillary structure
Official title: {characterised by the material or the construction of the capillary structure}
F28D15/046 (Characterised by the material or the construction of the capillary structure) appears on 1,090 US grants and 1,683 published applications in this corpus.
Search patents in F28D- Granted patents
- 1,090
- Published applications
- 1,683
- Assignees
- 511
- Inventors
- 2,464
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 11 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 7 | 0 |
| 1986 | 5 | 0 |
| 1987 | 6 | 0 |
| 1988 | 6 | 0 |
| 1989 | 13 | 0 |
| 1990 | 9 | 0 |
| 1991 | 9 | 0 |
| 1992 | 2 | 0 |
| 1993 | 8 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 8 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 10 | 3 |
| 2002 | 9 | 10 |
| 2003 | 10 | 20 |
| 2004 | 13 | 23 |
| 2005 | 18 | 49 |
| 2006 | 35 | 73 |
| 2007 | 21 | 75 |
| 2008 | 15 | 37 |
| 2009 | 20 | 50 |
| 2010 | 25 | 72 |
| 2011 | 15 | 66 |
| 2012 | 16 | 56 |
| 2013 | 27 | 78 |
| 2014 | 28 | 57 |
| 2015 | 32 | 53 |
| 2016 | 31 | 60 |
| 2017 | 33 | 67 |
| 2018 | 57 | 67 |
| 2019 | 59 | 93 |
| 2020 | 65 | 127 |
| 2021 | 72 | 94 |
| 2022 | 63 | 100 |
| 2023 | 76 | 99 |
| 2024 | 74 | 93 |
| 2025 | 62 | 102 |
| 2026 | 57 | 59 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Main body sheet for vapor chamber, vapor chamber, and electronic apparatus6 Oct 2026US 12,757,355 B2Dai Nippon Printing Co.Ltd.
- Vapor chamber having a reservoir15 Sep 2026US 12,736,291 B2Razer (Asia-Pacific) Pte. Ltd.
- Vapor chamber with dynamically adjustable local evaporative resistance15 Sep 2026US 12,740,017 B2Intel Corporation
- Wick structure for thin heatpipes8 Sep 2026US 12,729,918 B2Dell Products L. P.
- Heat pipe fuel element and fission reactor incorporating same, particularly having phyllotaxis spacing pattern of heat pipe fuel elements, and method of manufacture8 Sep 2026US 12,731,700 B2BWXT Advanced Technologies LLC
- Wick structure for thin heatpipes24 Sep 2026US 2026/0287273 A1Dell Products L. P.
- Flexible heat pipe17 Sep 2026US 2026/0274448 A1Government of the United States as Represented by the Secretary of the Air Force
- Bendable shapeable heat plate structure17 Sep 2026US 2026/0276312 A1Nidec Chaun-Choung Technology Corporation
- Heat pipe apparatuses17 Sep 2026US 2026/0276314 A1Wisconsin Alumni Research Foundation
- Heat management medium completely filled with open porous material10 Sep 2026US 2026/0266556 A1Industry Foundation of Chonnam National University
Most cited
By later US patents
- Cooling device with heat pipe167US 6,082,443 AFurukawa Electric Co., Ltd. · 2000
- Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels138US 4,450,472 AThe Board of Trustees of the Leland Stanford Junior University · 1984
- Sintered grooved wicks125US 4,274,479 AThermacore, Inc. · 1981
- Method and means for improved heat removal in compact semiconductor integrated circuits117US 4,573,067 AThe Board of Trustees of the Leland Stanford Junior University · 1986
- Optimized integral heat pipe and electronic circuit module arrangement113US 5,216,580 ASun Microsystems, Inc. · 1993