Method and means for improved heat removal in compact semiconductor integrated circuits
AssigneeThe Board of Trustees of the Leland Stanford Junior University
InventorsDavid B. Tuckerman, Roger F. W. Pease
Life of this patent
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Abstract
A semiconductor chip having improved heat dissipation capability. The back surface of a semiconductor chip is provided with microscopic channels defined by fins in intimate contact with the chip. A cover is affixed to the fins to enclose the channels for the laminar flow of coolant fluid. The chip can be mounted in a recessed portion of a dual in-line package (DIP) with conductive tubes integral with the package providing the flow of coolant. Advantageously, the tubes can function as power busses to the integrated circuit.
Claims18
A heat generating device having improved heat removal capability comprising a body portion having an external surface for cooling, a plurality of microscopic channels defined by fins in intimate contact with said external surface, each of said microscopic channels having a width selected to increase the heat transfer over that associated only with an increase in area thereby to substantially increase the heat transfer from the body per unit area of channel surface, and a cover attached to said fins to confine the flow of a coolant fluid through said channels.
A semiconductor integrated circuit having improved heat removal capability comprising
- a semiconductor chip having an integrated circuit defined in a first major surface,
- a plurality of microscopic channels defined by fins in intimate contact with a second major surface opposite from said first surface, each of said microscopic channels having a width selected to increase the heat transfer over that associated only with an increase in area thereby to substantially increase the heat transfer from the body per unit area of channel surface,
- a cover attached to said fins to confine the flow of coolant fluid through said channels, and
- means for flowing coolant fluid through said channels, said microscopic channels being dimensioned so as to allow laminar flow for substantially the whole length of the channel.
A semiconductor integrated circuit and package having improved heat removal capability comprising
- a support member having a recessed portion in a major surface, a plurality of bonding pads within said recessed portion, and a plurality of conductive leads extending from said support member and in electrical contact with said bonding pads,
- a semiconductor integrated circuit chip having an integrated circuit defined in a first major surface and having a plurality of microscopic fins in integral contact with a second major surface opposite from said first major surface, said semiconductor integrated chip mounted in said recessed portion with said integrated circuit in electrical contact with said bonding pads,
- a first tube for applying a coolant fluid to one end of said recessed portion and a second tube for removing coolant from a second end of said recessed portion opposite from said first end, and
- a cover affixed to said fins and defining microscopic channels whereby coolant fluid flows from said first tube through said channels and then to said second tube.
A method of removing heat from a semiconductor chip having an integrated circuit defined in a first major surface comprising the steps of
- forming a plurality of microscopic fins in intimate contact with a second major surface of said chip opposite from said first major surface, the region between each pair of fins forming a channel for the flow of coolant, the width of each such channel being selected to increase the heat transfer from said chip per unit of channel surface area over that associated only with an increase in area,
- affixing a cover on said fins to define channels for the flow of coolant between fins, and
- laminarly flowing a coolant through said channels.
Dependencies are inferred from the claim text.