C25D 21/16
Regeneration of process solutions
C25D21/16 (Regeneration of process solutions) appears on 384 US grants and 353 published applications in this corpus.
Search patents in C25D- Granted patents
- 384
- Published applications
- 353
- Assignees
- 263
- Inventors
- 1,005
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 8 | 0 |
| 1978 | 6 | 0 |
| 1979 | 7 | 0 |
| 1980 | 9 | 0 |
| 1981 | 11 | 0 |
| 1982 | 9 | 0 |
| 1983 | 3 | 0 |
| 1984 | 11 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 7 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 9 | 4 |
| 2002 | 12 | 9 |
| 2003 | 10 | 18 |
| 2004 | 9 | 23 |
| 2005 | 12 | 13 |
| 2006 | 8 | 11 |
| 2007 | 9 | 12 |
| 2008 | 3 | 6 |
| 2009 | 4 | 11 |
| 2010 | 9 | 10 |
| 2011 | 3 | 12 |
| 2012 | 6 | 16 |
| 2013 | 7 | 9 |
| 2014 | 6 | 11 |
| 2015 | 9 | 19 |
| 2016 | 10 | 13 |
| 2017 | 14 | 13 |
| 2018 | 15 | 22 |
| 2019 | 13 | 18 |
| 2020 | 12 | 10 |
| 2021 | 12 | 11 |
| 2022 | 9 | 22 |
| 2023 | 12 | 13 |
| 2024 | 13 | 23 |
| 2025 | 5 | 11 |
| 2026 | 3 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Low alpha-ray emission stannous oxide and method of producing the same5 May 2026US 12,617,694 B2Mitsubishi Materials Corporation
- Electroplating systems and methods with increased metal ion concentrations21 Apr 2026US 12,606,928 B2APPLIED Materials.Inc.
- Method of liquid management in anode chamber and apparatus for plating17 Mar 2026US 12,577,699 B2Ebara Corporation
- Techniques for forecasting and/or preventing degradation and corrosion18 Nov 2025US 12,474,252 B2AMS Trace Metals, Inc.
- Byproduct removal from electroplating solutions19 Aug 2025US 12,392,047 B2Lam Research Corporation
- Conductivity enhanced metal-nanocarbon hybrids and method for preparation1 Oct 2026US 2026/0297790 A1
- Method for metal ion removal from metal-containing solution using fluidized bed homogeneous crystallization24 Sep 2026US 2026/0285717 A1National Chunghsing University
- Method for managing electrodeposition liquid, and electrodeposition device3 Sep 2026US 2026/0258576 A1Mitsubishi Materials Corporation
- Removal of metal salt precipitates in an electroplating tool6 Aug 2026US 2026/0226648 A1Lam Research Corporation
- Treatment and recycling of wastewater from trivalent chromium plating processes30 Jul 2026US 2026/0217572 A1MacDermid Enthone Inc.
Most cited
By later US patents
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability158US 6,099,702 ANovellus Systems, Inc. · 2000
- Copper metallization of silicon wafers using insoluble anodes83US 6,024,856 AEnthone-OMI, Inc. · 2000
- Rotary plater with radially distributed plating solution79US 6,001,235 AInternational Business Machines Corporation · 1999