Byproduct removal from electroplating solutions

An electroplating system comprising:

• an electroplating cell configured to contain an anode and an electroplating solution;
• a wafer holder configured to support a wafer within the electroplating cell;
• a reservoir configured to contain at least a portion of the electroplating solution;
• a recirculation flowpath that fluidically connects the reservoir and the electroplating cell, wherein the recirculation flowpath includes a pump and is configured to circulate the electroplating solution between the reservoir and the electroplating cell;
• a frother fluidically connected to one or more of:
• the electroplating cell, the reservoir, and the recirculation flowpath;
• and
• a container fluidically connected to one or more of:
• the electroplating cell, the reservoir, or the recirculation flowpath, and configured to receive and hold a first volume of the electroplating solution, wherein:
• the frother is configured to:
• generate bubbles in the electroplating solution in the container when the electroplating solution is present in the container, interfaced with the frother, and the frother is activated, and
• generate a foam in the container which traps a byproduct of electroplating, the container has:
• a foam exit port configured to allow the foam in the container to exit the container through the foam exit port, and
• a fluid outlet lower in elevation than the foam exit port, and
• the electroplating system is configured to remove the foam with the byproduct trapped therein from the electroplating system through the foam exit port in an unaided manner, and
• the foam is configured to flow out of the container with the assistance of gravity and/or a pressure of the foam in the container.