C25D 17/28
With means for moving the objects individually through the apparatus during treatment
Official title: with means for moving the objects individually through the apparatus during treatment
C25D17/28 (With means for moving the objects individually through the apparatus during treatment) appears on 96 US grants and 65 published applications in this corpus.
Search patents in C25D- Granted patents
- 96
- Published applications
- 65
- Assignees
- 66
- Inventors
- 237
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 7 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 7 | 0 |
| 2002 | 2 | 2 |
| 2003 | 1 | 2 |
| 2004 | 0 | 5 |
| 2005 | 2 | 3 |
| 2006 | 1 | 8 |
| 2007 | 2 | 3 |
| 2008 | 1 | 0 |
| 2009 | 2 | 7 |
| 2010 | 2 | 1 |
| 2011 | 3 | 3 |
| 2012 | 2 | 0 |
| 2013 | 2 | 1 |
| 2014 | 2 | 1 |
| 2015 | 2 | 2 |
| 2016 | 0 | 0 |
| 2017 | 1 | 4 |
| 2018 | 0 | 0 |
| 2019 | 1 | 2 |
| 2020 | 3 | 3 |
| 2021 | 2 | 1 |
| 2022 | 2 | 4 |
| 2023 | 0 | 3 |
| 2024 | 1 | 1 |
| 2025 | 4 | 7 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Anode plate for film plating machine and film plating machine7 Apr 2026US 12,595,582 B2Hithium Tech HK Limited
- Electroplating device and method for manufacturing plated product8 Jul 2025US 12,351,930 B2YKK Corporation
- Plating method and plating apparatus8 Jul 2025US 12,351,933 B2Ebara Corporation
- Manufacturing method and apparatus for electronic component8 Jul 2025US 12,351,934 B2Suzhou Maxwell Technologies Co., Ltd.
- Plating apparatus and operation method thereof8 Apr 2025US 12,270,119 B2Pyxis Cf Pte. Ltd.
- Horizontal electroplating production line7 May 2026US 2026/0125818 A1Universal Circuit Board Equipment Co., Ltd.
- Plating apparatus and operation method thereof15 Jan 2026US 2026/0015754 A1Pyxis Cf Pte. Ltd.
- Clean workpiece loader and edge protection holder for wet chemical semiconductor processing6 Nov 2025US 2025/0343063 A1Asmpt Nexx, Inc.
- Plating apparatus and cleaning method for cleaning substrate holder28 Aug 2025US 2025/0270729 A1Ebara Corporation
- Vertical continuous plating device enabling to control plating deviation based on thickness difference of to-be-plated objects7 Aug 2025US 2025/0250712 A1TPS Elecomm CO., LTD.
Most cited
By later US patents
- Method and conveyorized system for electorlytically processing work pieces108US 7,563,352 B2Atotech Deutschland GmbH · 2009
- Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like52US 4,534,843 ATechnic, Inc. · 1985
- Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals50US 4,155,815 A1979
- Device for the electroplating treatment of plate-shaped objects29US 4,776,939 ASchering Corporation · 1988
- High volume workpiece handling and chemical treating system26US 5,100,516 AYamaha Hatsudoki Kabushiki Kaisha · 1992