Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like

An improved apparatus for electroplating projecting contact elements of encapsulated electronic components, and their like, comprising:

• a continuous flexible conveyor belt of electrically conductive material;
• guide means for said conveyor belt, constraining the motion thereof in a substantially horizontal plane, with a web of said conveyor belt in a substantially vertical alignment;
• grip means, comprised of adjacent, multiply-bent elastic elements of alternatingly assymetrical shape, configured to frictionally engage portions of said contact elements therebetween, arrayed along the distal edge of said conveyor belt and in intimate, electrically conductive contact therewith;
• drive means for said conveyor belt;
• a plurality of containers for liquid treatment media disposed along the path of said conveyor belt, with at least one of said containers supplied with liquid electrolyte, each such container being provided with weirs in its upper edge adapted to pass the conveyor belt and encapsulated electronic components suspended therefrom inwardly and outwardly of the liquid contained in said tank;
• recirculating means, for recovering liquid treatment media escaping from said containers through said weirs and returning such media to said containers, and
• electroplating current supply means, including at least one electrode disposed within the liquid volume of said one container and at least one current transfer brush in contact with the conveyor belt, for supplying plating current for the deposition of a metallic substance from said electrolyte onto said contact elements.