Plating method and plating apparatus

A plating method for performing a plating process of a substrate with a plating apparatus comprising a substrate holder including a contact member that conductively contacts the substrate, the plating method comprising:

• a step of tilting the substrate holder,
• a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted,
• a step of performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply the liquid to the contact member,
• a step of stopping the discharging of the liquid,
• a step of starting decrease of tilt of the substrate holder to a horizontal position concurrently with or within a predetermined time before or after stopping the discharging of the liquid,
• a step of rotating the substrate holder at a second rotation speed higher than the first rotation speed while the substrate holder is at the horizontal position,
• a step of stopping rotation of the substrate holder at the second rotation speed,
• a step of attaching the substrate to the substrate holder that is stopped from being rotated, and
• a step of performing the plating process on the attached substrate.