Plating apparatus and operation method thereof
AssigneePyxis Cf Pte. Ltd.
InventorsAmlan Sen, Navaneetha Kumaran Baheerathan
Life of this patent
Estimating the term…
Abstract
A plating apparatus and a plating method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; a fixing device configured to fix the substrate at the opening of the side wall; at least one sealing element disposed around the opening; and a cleaning module coupled to the tank body for cleaning the at least one sealing element. A cleaning method is also provided for cleaning the at least one sealing element with the cleaning module after operation of the plating apparatus.
Claims20
A plating apparatus for performing plating treatment on a substrate, comprising:
- a tank body comprising at least one side wall, the at least one side wall being provided with an opening extending from an inside to an outside of the tank body, the tank body being configured to accommodate a plating solution;
- a fixing device configured to fix the substrate to the outside of the tank body at the opening of the at least one side wall;
- at least one sealing element disposed around the opening;
- and
- a cleaning module coupled to the plating apparatus for cleaning the at least one sealing element, wherein the cleaning module comprises a plate assembly and a roller assembly coupled together, wherein the plate assembly provides a mechanical support to the roller assembly and the roller assembly is configured to clean the at least one sealing element, and
- wherein the roller assembly comprises a feeder roller for supplying a fresh tape to the at least one sealing element and a receiver roller for receiving a contaminated tape from the at least one sealing element, wherein the fresh tape is turned into the contaminated tape for cleaning the at least one sealing element.
A cleaning module for cleaning at least one sealing element of a plating apparatus, comprising:
- a plate assembly coupled to the plating apparatus;
- and
- a roller assembly coupled to the plate assembly for cleaning the at least one sealing element at a working location, wherein the roller assembly is configured to supply a fresh tape to the at least one sealing element and configured to receive a contaminated tape from the at least one sealing element, wherein the fresh tape is turned into the contaminated tape for cleaning the at least one sealing element.
A plating apparatus for performing plating treatment on a substrate, comprising:
- a tank body comprising at least one side wall, the at least one side wall being provided with an opening extending from an inside to an outside of the tank body, the tank body being configured to accommodate a plating solution;
- a fixing device configured to fix the substrate to the outside of the tank body at the opening of the at least one side wall;
- at least one sealing element disposed around the opening;
- and
- a cleaning module coupled to the plating apparatus for cleaning the at least one sealing element, wherein the cleaning module comprises a plate assembly and a roller assembly coupled together, wherein the plate assembly provides a mechanical support to the roller assembly and the roller assembly is configured to clean the at least one sealing element,
- wherein the cleaning module further comprises a handling assembly for moving the roller assembly towards a working location where the roller assembly is configured to clean the at least one sealing element and for moving the roller assembly away from the working location after cleaning the at least one sealing element, and
- wherein the handling assembly comprises a first guiding rail extending in a first direction substantially parallel with an edge of the opening of the at least one side wall and a handle movably coupled to the first guiding rail for moving the roller assembly along the first guiding rail in the first direction.
A plating apparatus for performing plating treatment on a substrate, comprising:
- a tank body comprising at least one side wall, the at least one side wall being provided with an opening extending from an inside to an outside of the tank body, the tank body being configured to accommodate a plating solution;
- a fixing device configured to fix the substrate to the outside of the tank body at the opening of the at least one side wall;
- at least one sealing element disposed around the opening;
- and
- a cleaning module coupled to the plating apparatus for cleaning the at least one sealing element, wherein the cleaning module comprises a plate assembly and a roller assembly coupled together, wherein the plate assembly provides a mechanical support to the roller assembly and the roller assembly is configured to clean the at least one sealing element,
- wherein the cleaning module further comprises a handling assembly for moving the roller assembly towards a working location where the roller assembly is configured to clean the at least one sealing element and for moving the roller assembly away from the working location after cleaning the at least one sealing element, and
- wherein the cleaning module comprises a holding station for holding the roller assembly at a waiting location away from the working location, and the holding station comprises a securing mechanism for removably securing the roller assembly at the holding station.
Dependencies are inferred from the claim text.