C25D 17/005
Contacting devices
Official title: {Contacting devices}
C25D17/005 (Contacting devices) appears on 318 US grants and 377 published applications in this corpus.
Search patents in C25D- Granted patents
- 318
- Published applications
- 377
- Assignees
- 173
- Inventors
- 731
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 9 | 0 |
| 2001 | 5 | 1 |
| 2002 | 8 | 4 |
| 2003 | 2 | 11 |
| 2004 | 2 | 7 |
| 2005 | 3 | 9 |
| 2006 | 1 | 11 |
| 2007 | 12 | 11 |
| 2008 | 6 | 9 |
| 2009 | 4 | 12 |
| 2010 | 11 | 10 |
| 2011 | 7 | 10 |
| 2012 | 13 | 22 |
| 2013 | 9 | 18 |
| 2014 | 8 | 8 |
| 2015 | 11 | 18 |
| 2016 | 16 | 31 |
| 2017 | 14 | 24 |
| 2018 | 17 | 16 |
| 2019 | 23 | 28 |
| 2020 | 11 | 22 |
| 2021 | 20 | 18 |
| 2022 | 23 | 22 |
| 2023 | 19 | 19 |
| 2024 | 17 | 15 |
| 2025 | 13 | 12 |
| 2026 | 3 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate holder, substrate plating device equipped therewith, and electrical contact28 Apr 2026US 12,612,710 B2Ebara Corporation
- Plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate13 Jan 2026US 12,522,941 B2Semsysco GmbH
- Method of plating and apparatus for plating6 Jan 2026US 12,516,437 B2Ebara Corporation
- Method and system for improving uniformity of plating film on wafer23 Dec 2025US 12,503,787 B2Changxin Memory Technologies, Inc.
- Detection of contact formation between a substrate and contact pins in an electroplating system23 Dec 2025US 12,503,788 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Anodizing apparatus and anodizing method therefor1 Oct 2026US 2026/0297788 A1Toyota Jidosha Kabushiki Kaisha
- Substrate holder, substrate plating device equipped therewith, and electrical contact30 Jul 2026US 2026/0218407 A1Ebara Corporation
- Apparatus for jewelry surface processing16 Jul 2026US 2026/0201593 A1
- Structure for uniform distribution of thicknesses of metal layers deposited with galvanizing process25 Jun 2026US 2026/0176787 A1Nicro Bolta, S.A. De C.V.
- Portable electrolytic deposition system including hydrogels and methods of using same18 Jun 2026US 2026/0168130 A1Chemeon Surface Technology, LLC
Most cited
By later US patents
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Device providing electrical contact to the surface of a semiconductor workpiece during metal plating86US 6,497,800 B1Nutool, Inc. · 2002
- Cathode current control system for a wafer electroplating apparatus81US 6,004,440 ASemitool, Inc. · 1999
- Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing78US 6,482,307 B2Nutool, Inc. · 2002