Substrate holder, substrate plating device equipped therewith, and electrical contact
AssigneeEbara Corporation
InventorsMasaya Seki, Kiyoshi Suzuki, Masayuki Satake
Life of this patent
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AssigneeEbara Corporation
InventorsMasaya Seki, Kiyoshi Suzuki, Masayuki Satake
Estimating the term…
Provided is a substrate holder for plating on a surface of a substrate, provided with an electrical contact that is easy to replace. A substrate holder 1 includes: a first holding member 2; a second holding member 3 that has an opening portion 3a for exposing the surface of a substrate W and holds the substrate W in a sandwiched manner with the first holding member 2; a plurality of engaging shaft portions 36 each having a head portion 36b in an expanded head shape at a tip end portion, provided in a circumferential direction of the second holding member 3; and an electrical contact 32 having a contact portion 32a to be in contact with an edge portion of the substrate W, and having an engagement reception portion 32b in a notch shape to be engaged with the adjacent engaging shaft portion 36 for arrangement along a circumference of the opening portion 3a of the second holding member 3.
A substrate holder for plating on a surface of a substrate, comprising:
An electrical contact attachment structure for attaching an electrical contact for applying an electric current to a substrate held by a substrate holder, wherein:
Dependencies are inferred from the claim text.