Back to results
US 12,503,787 B2Granted
Method and system for improving uniformity of plating film on wafer
AssigneeChangxin Memory Technologies, Inc.
InventorYulong Gao
Life of this patent
Estimating the term…
Abstract
A method and system for improving uniformity of plating film on the wafer are provided. The method includes: providing a plating device; providing a wafer, the plating device being configured to coat the wafer; monitoring currents at different areas of a surface of the wafer in a plating process; when a difference between the currents at the different areas of the surface of the wafer is greater than a preset difference, inspecting the plating device; and when an attachment is present on the plating device, cleaning the plating device.
Claims11
A method for improving uniformity of plating film on a wafer, comprising:
- providing a plating device configured to plate a wafer;
- providing the wafer and performing a plating process on the wafer by the plating device;
- monitoring currents at different areas of a surface of the wafer in a plating process to determine whether a difference between the currents at the different areas of the surface of the wafer is greater than a preset difference;
- responsive to the difference between the currents at the different areas of the surface of the wafer being greater than the preset difference, performing a check-up operation on the plating device to detect whether an unwanted attachment is present on the plating device;
- and
- responsive to detecting that the unwanted attachment is present on the plating device, performing a cleaning operation on the plating device.
3 more elements
Dependencies are inferred from the claim text.