Method of plating and apparatus for plating

A method of plating, comprising:

• holding a substrate by a substrate holder, the process comprising forming a sealed space to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, causing the substrate to come into contact with the contact cleaned and covered with a liquid having electric conductivity controlled to be lower than a predetermined reference value, and locally covering a contact location between the substrate and the contact with the liquid in the sealed space;
• soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode;
• and
• performing a plating process on the substrate by supplying electric current between the substrate and the anode, wherein the contact location between the substrate and the contact is covered with the liquid during the plating process, cleaning the contact by supplying liquid from a cleaning nozzle to the contact, the contact being disposed in a recess of the substrate holder, wherein, after cleaning, the liquid remains around the contact in an amount equal to or greater than a predetermined amount, and wherein the cleaning nozzle is a component separate from the substrate holder.