C25D 17/001
Apparatus specially adapted for electrolytic coating of wafers
Official title: {Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells}
C25D17/001 (Apparatus specially adapted for electrolytic coating of wafers) appears on 1,332 US grants and 1,679 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,332
- Published applications
- 1,679
- Assignees
- 262
- Inventors
- 1,864
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 7 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 8 | 0 |
| 2000 | 28 | 0 |
| 2001 | 60 | 20 |
| 2002 | 53 | 75 |
| 2003 | 59 | 91 |
| 2004 | 54 | 121 |
| 2005 | 52 | 108 |
| 2006 | 42 | 87 |
| 2007 | 55 | 46 |
| 2008 | 36 | 44 |
| 2009 | 27 | 37 |
| 2010 | 51 | 53 |
| 2011 | 39 | 42 |
| 2012 | 43 | 61 |
| 2013 | 36 | 49 |
| 2014 | 27 | 67 |
| 2015 | 33 | 58 |
| 2016 | 48 | 66 |
| 2017 | 67 | 76 |
| 2018 | 56 | 71 |
| 2019 | 67 | 79 |
| 2020 | 61 | 55 |
| 2021 | 56 | 46 |
| 2022 | 53 | 68 |
| 2023 | 64 | 82 |
| 2024 | 46 | 83 |
| 2025 | 50 | 60 |
| 2026 | 27 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Plating apparatus, control method for plating apparatus and nonvolatile storage medium storing program7 Jul 2026US 12,674,248 B2Ebara Corporation
- Plating apparatus, control method for plating apparatus and nonvolatile storage medium storing program1 Oct 2026US 2026/0297791 A1Ebara Corporation
- Electroplating apparatus17 Sep 2026US 2026/0275563 A1ACM Research (Shanghai) Inc.
- Differential contrast plating for advanced packaging applications3 Sep 2026US 2026/0258571 A1Lam Research Corporation
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- Substrate processing apparatus27 Aug 2026US 2026/0250876 A1Ebara Corporation
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Apparatus for electro-chemical deposition with thermal anneal chamber441US 6,136,163 AAPPLIED Materials.Inc. · 2000
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001
- In-situ electroless copper seed layer enhancement in an electroplating system310US 6,258,223 B1APPLIED Materials.Inc. · 2001