Plating apparatus, control method for plating apparatus and nonvolatile storage medium storing program
AssigneeEbara Corporation
InventorsYosuke Nagasawa, Tensei Sato, Hideki Wakabayashi
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AssigneeEbara Corporation
InventorsYosuke Nagasawa, Tensei Sato, Hideki Wakabayashi
Estimating the term…
The present disclosure provides a plating apparatus that can determine an acceleration at the time of an inappropriate deceleration of a transfer device that may cause contact between a substrate holder and a processing tank, a control method for a plating apparatus, and a storage medium storing a program. The plating apparatus according to the present disclosure includes a transfer device including an imaging device, the processing tank having an opening, a reference mark, and a control device, the control device is configured to be able to execute a test at a test acceleration, and the test includes: controlling, by the control device, the imaging device to capture a reference image when the transfer device is located at a determination position directly above the processing tank; moving the transfer device from a reference position to the determination position; controlling the imaging device to capture a comparison video when and after the transfer device stops; and determining, based on the reference image and the comparison video, whether the lower end portion of the substrate holder protrudes outside a region where the opening is extended in a vertical direction, to determine that the test acceleration has an inappropriate value when the lower end portion protrudes outside the region.
A plating apparatus comprising:
Dependencies are inferred from the claim text.