C25D 1/00
Electroforming
C25D1/00 (Electroforming) appears on 1,607 US grants and 1,908 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,607
- Published applications
- 1,908
- Assignees
- 840
- Inventors
- 3,697
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 16 | 0 |
| 1978 | 14 | 0 |
| 1979 | 7 | 0 |
| 1980 | 14 | 0 |
| 1981 | 19 | 0 |
| 1982 | 15 | 0 |
| 1983 | 15 | 0 |
| 1984 | 20 | 0 |
| 1985 | 20 | 0 |
| 1986 | 12 | 0 |
| 1987 | 22 | 0 |
| 1988 | 17 | 0 |
| 1989 | 11 | 0 |
| 1990 | 18 | 0 |
| 1991 | 18 | 0 |
| 1992 | 15 | 0 |
| 1993 | 19 | 0 |
| 1994 | 15 | 0 |
| 1995 | 22 | 0 |
| 1996 | 13 | 0 |
| 1997 | 13 | 0 |
| 1998 | 26 | 0 |
| 1999 | 36 | 0 |
| 2000 | 15 | 0 |
| 2001 | 36 | 19 |
| 2002 | 28 | 39 |
| 2003 | 24 | 42 |
| 2004 | 28 | 70 |
| 2005 | 20 | 83 |
| 2006 | 25 | 54 |
| 2007 | 33 | 75 |
| 2008 | 24 | 64 |
| 2009 | 21 | 81 |
| 2010 | 47 | 82 |
| 2011 | 36 | 65 |
| 2012 | 33 | 68 |
| 2013 | 50 | 77 |
| 2014 | 34 | 78 |
| 2015 | 47 | 69 |
| 2016 | 54 | 86 |
| 2017 | 75 | 78 |
| 2018 | 50 | 96 |
| 2019 | 70 | 104 |
| 2020 | 81 | 99 |
| 2021 | 82 | 93 |
| 2022 | 63 | 81 |
| 2023 | 63 | 85 |
| 2024 | 66 | 87 |
| 2025 | 62 | 78 |
| 2026 | 30 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- C25D 1/04Wires486
- C25D 1/10Moulds310
- C25D 1/0033d structures290
- C25D 1/08Perforated or foraminous objects266
- C25D 1/20Separation of the formed objects from the electrodes with no destruction of169
- C25D 1/02Tubes166
- C25D 1/006Nanostructures104
- C25D 1/12Electroforming: by electrophoresis73
All 9 subgroupsShow fewer
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom25 Aug 2026US 12,716,144 B2Dupont Electronics, Inc.
- Optical transitional switch18 Aug 2026US 12,710,235 B2Raytheon Company
- Master plate and manufacturing method of metal formed article28 Jul 2026US 12,692,613 B2FUJIFILM Corporation
- Methods of operating electrochemical-additive manufacturing systems comprising modular cartridge assemblies30 Jun 2026US 12,668,023 B2Fabric8Labs, Inc.
- Electrodeposited high entropy alloy nanostructures and methods of fabrication8 Oct 2026US 2026/0308794 A1Georgetown University
- System and method for forming a metallic component1 Oct 2026US 2026/0297783 A1Unison Industries, LLC
- System and method for electroforming a metallic component1 Oct 2026US 2026/0297784 A1Unison Industries, LLC
- Electroforming master plate, manufacturing method for electroforming master plate, and electroformed product1 Oct 2026US 2026/0297785 A1FUJIFILM Corporation
- Electrodeposited copper foil and applications thereof24 Sep 2026US 2026/0286560 A1Dupont Electronics, Inc.
Most cited
By later US patents
- Method of incremental object fabrication450US 5,614,075 A1997
- Plating cell with rotary wiper and megasonic transducer282US 5,904,827 AReynolds Tech Fabricators, Inc. · 1999
- Method for electrochemical fabrication261US 6,027,630 AUniversity of Southern California · 2000
- Miniature RF and microwave components and methods for fabricating such components233US 7,830,228 B2Microfabrica Inc. · 2010
- Three dimensional microfabrication by localized electrodeposition and etching232US 5,641,391 A1997