Electroforming master plate, manufacturing method for electroforming master plate, and electroformed product
AssigneeFUJIFILM Corporation
InventorsKozue IKEDA, Tomokazu UMEZAWA
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Abstract
Provided are an electroforming master plate including a substrate, a conductive layer provided on a surface of the substrate, an insulating mask pattern provided on the substrate or the conductive layer, and an adhesion control layer provided on a region of the conductive layer in which the insulating mask pattern is not provided, in which the adhesion control layer is a porous film formed of an insulating material and has a thickness of 1 nm to 50 nm, the thickness being thinner than a thickness of the insulating mask pattern, manufacturing method of the same, and an electroformed product.
Claims13
An electroforming master plate comprising:
- a substrate;
- a conductive layer provided on a surface of the substrate;
- an insulating mask pattern provided on the substrate or the conductive layer;
- and
- an adhesion control layer provided on the conductive layer,
- wherein the adhesion control layer is a porous film formed of an insulating material and has a thickness of 1 nm to 50 nm, the thickness being thinner than a thickness of the insulating mask pattern.
A manufacturing method for an electroforming master plate, comprising:
- a step of removing a natural oxide film on a silicon substrate having an insulating mask pattern on a surface of the silicon substrate;
- a step of forming a metal film on the silicon substrate;
- a step of forming a capping layer on the metal film;
- a step of annealing a structure including the metal film and the capping layer on the silicon substrate;
- and
- a washing step of removing the capping layer.
Dependencies are inferred from the claim text.