C23F 1/36
For etching aluminium or alloys thereof
Official title: for etching aluminium or alloys thereof
C23F1/36 (For etching aluminium or alloys thereof) appears on 96 US grants and 97 published applications in this corpus.
Search patents in C23F- Granted patents
- 96
- Published applications
- 97
- Assignees
- 98
- Inventors
- 335
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 6 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 3 | 1 |
| 2006 | 1 | 3 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 3 |
| 2012 | 0 | 4 |
| 2013 | 3 | 3 |
| 2014 | 3 | 1 |
| 2015 | 6 | 6 |
| 2016 | 3 | 7 |
| 2017 | 2 | 7 |
| 2018 | 3 | 4 |
| 2019 | 5 | 8 |
| 2020 | 5 | 4 |
| 2021 | 2 | 11 |
| 2022 | 6 | 8 |
| 2023 | 7 | 7 |
| 2024 | 7 | 3 |
| 2025 | 6 | 4 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for producing plasmonic-nanostructure spectrally selective solar absorber having high solar absorptance, low thermal emittance, and high thermal stability16 Jun 2026US 12,656,024 B2Northeastern University
- Composition and method for creating nanoscale surface geometry on an implantable device31 Mar 2026US 12,590,248 B2Tech Met, Inc.
- Electronic device including plate, plate, and method for manufacturing plate16 Dec 2025US 12,501,568 B2Samsung Electronics Co., Ltd.
- Method of selectively etching a metal component25 Nov 2025US 12,480,046 B2Microsoft Technology Licensing, LLC
- Aluminum alloy brazing sheet and method for manufacturing the same14 Oct 2025US 12,440,929 B2Uacj Corporation
- Composition and method for creating nanoscale surface geometry on an implantable device30 Jul 2026US 2026/0218048 A1Tech Met, Inc.
- Composition, method of treating metal-containing layer, and method of manufacturing semiconductor device4 Jun 2026US 2026/0152687 A1Samsung Electronics Co., Ltd.
- Composition, method of treating metal-containing layer by using the same, and method of manufacturing semiconductor device by using the same9 Apr 2026US 2026/0098346 A1Samsung Electronics Co., Ltd.
- Composition, method of treating metal-containing layer by using the same, and method of manufacturing semiconductor device by using the same1 Jan 2026US 2026/0005029 A1Samsung Electronics Co., Ltd.
- Method for Producing Aluminum-Resin Composite, and Surface Treatment Agent18 Dec 2025US 2025/0381760 A1Mec Company Ltd.
Most cited
By later US patents
- Etching of metallic composite articles159US 6,468,439 B1BMC Industries, Inc. · 2002
- Circuit manufacturing using etched tri-metal media125US 6,365,057 B1BMC Industries, Inc. · 2002
- Lamination of circuit sub-elements while assuring registration120US 6,409,930 B1BMC Industries, Inc. · 2002
- Generation of compact alumina passivation layers on aluminum plasma equipment components108US 9,903,020 B2APPLIED Materials.Inc. · 2018
- Conditioned semiconductor system parts107US 9,885,117 B2APPLIED Materials.Inc. · 2018