C23C 18/54
Contact plating, i.e. electroless electrochemical plating
C23C18/54 (Contact plating, i.e. electroless electrochemical plating) appears on 416 US grants and 537 published applications in this corpus.
Search patents in C23C- Granted patents
- 416
- Published applications
- 537
- Assignees
- 328
- Inventors
- 1,360
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 2 |
| 2002 | 4 | 5 |
| 2003 | 7 | 12 |
| 2004 | 9 | 15 |
| 2005 | 4 | 9 |
| 2006 | 4 | 11 |
| 2007 | 3 | 12 |
| 2008 | 10 | 15 |
| 2009 | 6 | 14 |
| 2010 | 2 | 31 |
| 2011 | 11 | 24 |
| 2012 | 14 | 35 |
| 2013 | 16 | 28 |
| 2014 | 24 | 34 |
| 2015 | 23 | 32 |
| 2016 | 25 | 48 |
| 2017 | 35 | 29 |
| 2018 | 20 | 27 |
| 2019 | 32 | 29 |
| 2020 | 28 | 25 |
| 2021 | 18 | 25 |
| 2022 | 20 | 23 |
| 2023 | 11 | 21 |
| 2024 | 10 | 10 |
| 2025 | 14 | 12 |
| 2026 | 4 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards25 Aug 2026US 12,716,133 B2Atotech Deutschland GmbH
- Semiconductor device manufacturing method5 May 2026US 12,618,158 B2Fuji Electric Co., Ltd.
- Metallic coated substrates10 Mar 2026US 12,571,105 B2Armadillo Metal Coatings Ltd
- Method for improving adhesion between metallization layers and ozone-etched plastics3 Feb 2026US 12,540,404 B2MacDermid Enthone Inc.
- Plating stack16 Dec 2025US 12,497,699 B2Japan Pure Chemical Co., Ltd.
- Catalyst application bath for electroless plating, method of producing catalytic nucleus-containing material to be electroless plated, method of producing material with electroless plating deposit, and material with electroless plating deposit24 Sep 2026US 2026/0286529 A1C. Uyemura & Co., Ltd.
- Metal substrate and surface treatment method10 Sep 2026US 2026/0265919 A1National Tsing Hua University
- Methods of electrochemical deposition20 Aug 2026US 2026/0242969 A1
- Hot-dip plated steel material13 Aug 2026US 2026/0234781 A1Nippon Steel Corporation
- Cathode electrode, composite body of cathode electrode and base material, electrolytic reduction device provided with cathode electrode, and method for producing composite body of cathode electrode and base material13 Aug 2026US 2026/0234816 A1Chiyoda Corporation
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process241US 6,616,967 B1Texas Instruments Incorporated · 2003
- Method for preparing a conductive pad for electrical connection and conductive pad formed81US 6,335,104 B12002
- Annealing process for electroless coated disks for high temperature applications72US 8,668,953 B1WD Media, LLC · 2014