C23C 18/26
Using organic liquids
Official title: using organic liquids
C23C18/26 (Using organic liquids) appears on 29 US grants and 21 published applications in this corpus.
Search patents in C23C- Granted patents
- 29
- Published applications
- 21
- Assignees
- 30
- Inventors
- 95
- Latest grant
- 16 Jul 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 1 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 4 |
| 2019 | 0 | 3 |
| 2020 | 1 | 1 |
| 2021 | 1 | 1 |
| 2022 | 2 | 2 |
| 2023 | 0 | 0 |
| 2024 | 2 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Polymer compositions suitable for producing plated products16 Jul 2024US 12,037,688 B2Basell Poliolefine Italia S.r.l.
- Methods of reducing the adhesion of a maskant2 Jul 2024US 12,024,649 B2Ac Products, Inc.
- Method of manufacturing a semiconductor element front side electrode17 May 2022US 11,335,595 B2Mitsubishi Electric Corporation
- Methods of reducing the adhesion of a maskant1 Mar 2022US 11,261,338 B2Ac Products, Inc.
- Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board23 Feb 2021US 10,927,463 B2C. Uyemura & Co., Ltd.
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Electrically conductive metal-coated fibers, continuous process for preparation thereof, and use thereof29 Jan 2026US 2026/0028532 A1Syscom Advanced Materials, Inc.
- Etching composition and method for etching at least one surface of a sulfur-containing thermoplastic resin-substrate29 May 2025US 2025/0171688 A1Atotech Deutschland GmbH
- Methods of reducing the adhesion of a maskant23 Jun 2022US 2022/0195219 A1Ac Products, Inc.
- Polymer Compositions Suitable For Producing Plated Products2 Jun 2022US 2022/0170162 A1Basell Poliolefine Italia S.r.l.
Most cited
By later US patents
- Treatment of a polyimide surface to improve the adhesion of metal deposited thereon43US 4,775,449 AGeneral Electric Company · 1988
- Adhesive for electroless plating and method of preparation of circuit board using this adhesive33US 4,752,499 AIbiden Co., Ltd. · 1988
- Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby29US 4,842,946 AGeneral Electric Company · 1989
- Adhesive for electroless plating and method of preparation of circuit board using this adhesive27US 5,021,472 AIbiden Co., Ltd. · 1991
- Additive processing electroless metal plating using aqueous photoresist20US 4,574,031 AAT&T Technologies, Inc. · 1986