Adhesive for electroless plating and method of preparation of circuit board using this adhesive
AssigneeIbiden Co., Ltd.
InventorRyo Enomoto
Life of this patent
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Abstract
An adhesive for electroless plating is composed of at least one kind of fine powders selected from either a cured heat resistant resin or an inorganic material and easily soluble in a predetermined solution and a heat resistant resin solution sparingly soluble in the predetermined solution by curing treatment. The adhesive for electroless plating in which the above fine powders are dispersed in the above uncured heat resistant resin solution, is coated on a circuit board, dried and cured to form an adhesive layer. When the above predetermined solution contacts with the surface of the adhesive layer, its surface is roughed to be formed a plating film having an excellent adhesiveness by electroless plating.
Claims6
A method of preparation of a circuit board comprising steps of:
- preparing fine powders of cured heat resistant resin soluble in a predetermined solution;
- dispersing said fine powders in an uncured heat resistant resin solution sparingly soluble in said predetermined solution by curing treatment, thereby forming an adhesive for electroless plating;
- coating said adhesive onto a substrate;
- drying and curing said adhesive with the substrate;
- and
- roughing the surface of said adhesive layer to be subjected a electoless plating thereto by dissolving at least a part of said fine powders on the surface of said adhesive layer with contact treatment of said predetermined solution with said adhesive layer.
Dependencies are inferred from the claim text.