Treatment of a polyimide surface to improve the adhesion of metal deposited thereon
AssigneeGeneral Electric Company
InventorsWilliam V. Dumas, Donald F. Foust
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Abstract
A method of improving the adhesion of metal applied on a polyimide surface is disclosed, in which the surface is first treated with an adhesion-promoting compound containing a nitrogen-oxygen moiety prior to plating of the metal thereon.
Claims24
A method for improving the adhesion of an applied metal layer to a polyimide surface which comprises reatment of the polyimide surface with an adhesion-promoting compound characterized by the presence of an >NO-- moiety.
In a method for the plating of metal on the surface of a polyimide substrate, the improvement which comprises treatment of the surface with an adhesion-promoting compound containing therein an >NO-- moiety prior to application of the metal layer by electroless deposition, said deposition followed by electroplating of more of the metal on the electroless-plated surface.
Dependencies are inferred from the claim text.