C23C 18/206
Use of metal other than noble metals and tin
Official title: {Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals (sensitising with tin C23C18/285, sensitising with noble metals C23C18/30)}
C23C18/206 (Use of metal other than noble metals and tin) appears on 96 US grants and 103 published applications in this corpus.
Search patents in C23C- Granted patents
- 96
- Published applications
- 103
- Assignees
- 93
- Inventors
- 305
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 3 |
| 2003 | 0 | 2 |
| 2004 | 1 | 2 |
| 2005 | 2 | 9 |
| 2006 | 3 | 5 |
| 2007 | 3 | 6 |
| 2008 | 2 | 2 |
| 2009 | 2 | 7 |
| 2010 | 2 | 4 |
| 2011 | 6 | 3 |
| 2012 | 1 | 2 |
| 2013 | 5 | 6 |
| 2014 | 2 | 8 |
| 2015 | 3 | 8 |
| 2016 | 7 | 7 |
| 2017 | 2 | 4 |
| 2018 | 4 | 4 |
| 2019 | 2 | 6 |
| 2020 | 3 | 5 |
| 2021 | 3 | 3 |
| 2022 | 3 | 2 |
| 2023 | 0 | 2 |
| 2024 | 2 | 1 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Catalyst solution for electroless plating devoid of an amine4 Nov 2025US 12,460,301 B2The Boeing Company
- Structure with conductive pattern and method for manufacturing same29 Jul 2025US 12,376,230 B2Asahi Kasei Kabushiki Kaisha
- Composite solder balls metallised on the surface and calibrated for the assembly of electronic boards9 Jul 2024US 12,030,138 B2Lipco Industrie
- Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate9 Jan 2024US 11,865,518 B2National Tsing Hua University
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Method for preparing non-electrically conductive antimicrobial articles18 Dec 2025US 2025/0382501 A1Eastman Kodak Company
- Catalyst ink for plating and electroless plating method using same31 Oct 2024US 2024/0360331 A1Korea Electrotechnology Research Institute
- Method for metallizing a non-metallic substrate and pre-treatment composition9 Nov 2023US 2023/0357932 A1Atotech Deutschland GmbH
- Catalyst solution for electroless plating devoid of an amine21 Sep 2023US 2023/0295808 A1The Boeing Company
Most cited
By later US patents
- Conductor track structures and method for production thereof118US 7,060,421 B2Lpkf Laser & Electronics AG · 2006
- Ink jet printing of printed circuit boards102US 4,668,533 AE. I. Du Pont de Nemours and Company · 1987
- Electroless deposition employing laser-patterned masking layer90US 4,865,873 AGeneral Electric Company · 1989
- Method for patterned metallization of a substrate surface75US 5,576,073 ALPKF CAD/CAM Systeme GmbH · 1996
- Printable electric circuits, electronic components and method of forming the same57US 7,902,639 B2Siluria Technologies, Inc. · 2011