C09J 2469/00
Presence of polycarbonate
C09J2469/00 (Presence of polycarbonate) appears on 83 US grants and 159 published applications in this corpus.
Search patents in C09J- Granted patents
- 83
- Published applications
- 159
- Assignees
- 84
- Inventors
- 418
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 3 | 3 |
| 2003 | 2 | 12 |
| 2004 | 4 | 1 |
| 2005 | 1 | 3 |
| 2006 | 1 | 3 |
| 2007 | 1 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 2 |
| 2011 | 0 | 4 |
| 2012 | 0 | 4 |
| 2013 | 0 | 6 |
| 2014 | 3 | 4 |
| 2015 | 1 | 6 |
| 2016 | 2 | 9 |
| 2017 | 2 | 9 |
| 2018 | 1 | 13 |
| 2019 | 12 | 7 |
| 2020 | 7 | 11 |
| 2021 | 5 | 16 |
| 2022 | 5 | 14 |
| 2023 | 8 | 11 |
| 2024 | 6 | 7 |
| 2025 | 12 | 3 |
| 2026 | 5 | 9 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Methods and formulations for bonding dissimilar materials30 Jun 2026US 12,668,049 B2CareFusion 303, Inc.
- Adhesive printing form attachment layer, method for its manufacture, and printing form attachment cylinder comprising the same26 May 2026US 12,636,877 B2Tesa SE
- Adhesive film and method for producing adhesive film12 May 2026US 12,624,258 B2Mitsubishi Gas Chemical Company, Inc.
- Special polymer layers for faster laminability of multilayer structures14 Apr 2026US 12,600,116 B2Covestro Deutschland AG
- Laminate peeling method, laminate, and laminate production method6 Jan 2026US 12,516,221 B2Nissan Chemical Corporation
- Secondary layer assembly for an impact surface and method thereof24 Sep 2026US 2026/0284492 A1Gear Ties LLC D/B/A Xtrudex
- Methods and formulations for bonding dissimilar materials24 Sep 2026US 2026/0285024 A1CareFusion 303, Inc.
- Adhesive for bonding dissimilar materials in medical device6 Aug 2026US 2026/0226331 A1CareFusion 303, Inc.
- Bonding assembly, battery, and electric apparatus16 Jul 2026US 2026/0204710 A1Contemporary Amperex Technology Co., Limited
- Primer composition in thermally detachable multilayer structure bonded with thermosetting adhesives18 Jun 2026US 2026/0167848 A1
Most cited
By later US patents
- Surfacing laminate with bonded with pigmented pressure sensitive adhesive44US 6,399,193 B1University of Massachusetts Lowell · 2002
- Adhesive bonding laminates17US 6,210,522 B1Lexmark International, Inc. · 2001
- Adhesive bonding laminates13US 6,361,146 B1Lexmark International, Inc. · 2002
- Hard coat film13US 6,787,236 B2Lintec Corporation · 2004
- Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same8US 6,733,880 B2Hitachi Chemical Company, Ltd. · 2004