C09J 2469/006
In the substrate
Official title: in the substrate
C09J2469/006 (In the substrate) appears on 52 US grants and 102 published applications in this corpus.
Search patents in C09J- Granted patents
- 52
- Published applications
- 102
- Assignees
- 60
- Inventors
- 282
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 2 | 3 |
| 2003 | 2 | 6 |
| 2004 | 3 | 1 |
| 2005 | 1 | 2 |
| 2006 | 0 | 3 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 2 |
| 2012 | 0 | 2 |
| 2013 | 0 | 5 |
| 2014 | 2 | 3 |
| 2015 | 1 | 5 |
| 2016 | 2 | 6 |
| 2017 | 1 | 8 |
| 2018 | 1 | 6 |
| 2019 | 9 | 5 |
| 2020 | 3 | 5 |
| 2021 | 3 | 11 |
| 2022 | 2 | 10 |
| 2023 | 5 | 7 |
| 2024 | 4 | 4 |
| 2025 | 8 | 0 |
| 2026 | 2 | 6 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Methods and formulations for bonding dissimilar materials30 Jun 2026US 12,668,049 B2CareFusion 303, Inc.
- Adhesive film and method for producing adhesive film12 May 2026US 12,624,258 B2Mitsubishi Gas Chemical Company, Inc.
- Flexible hardgoods with enhanced peel removability18 Nov 2025US 12,471,723 B23M Innovative Properties Company
- Process for the preparation of a bonded structure, a bonded structure and use of said bonded structure for preparing an automotive part9 Sep 2025US 12,409,613 B2Sabic Global Technologies B.V.
- Multilayer film and molded body provided with same2 Sep 2025US 12,404,425 B2Kuraray Co., Ltd.
- Methods and formulations for bonding dissimilar materials24 Sep 2026US 2026/0285024 A1CareFusion 303, Inc.
- Adhesive for bonding dissimilar materials in medical device6 Aug 2026US 2026/0226331 A1CareFusion 303, Inc.
- Bonding assembly, battery, and electric apparatus16 Jul 2026US 2026/0204710 A1Contemporary Amperex Technology Co., Limited
- Back adhesive sticker9 Apr 2026US 2026/0098184 A1Ningbo Hyderon Hardware Co., Ltd.
- Insulation and heat-dissipation pad and electronic device including same5 Feb 2026US 2026/0040495 A1Illinois Tool Works Inc.
Most cited
By later US patents
- Surfacing laminate with bonded with pigmented pressure sensitive adhesive44US 6,399,193 B1University of Massachusetts Lowell · 2002
- Hard coat film13US 6,787,236 B2Lintec Corporation · 2004
- Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same8US 6,733,880 B2Hitachi Chemical Company, Ltd. · 2004
- Primer for silicone compositions7US 6,475,329 B1Tyco Electronics Corporation · 2002
- Polycarbonate articles and adhesive composition therefor7US 6,599,602 B23M Innovative Properties Company · 2003