Insulation and heat-dissipation pad and electronic device including same
AssigneeIllinois Tool Works Inc.
InventorsRun SU, Sijun KANG
Life of this patent
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Abstract
The present disclosure disclosed an insulation and heat-dissipation pad and an electronic device including same, the insulation and heat-dissipation pad comprises: a thermally conductive insulation film; and a thermosetting adhesive layer. The thermosetting adhesive layer is pre-bonded to the thermally conductive insulation film, and the thermosetting adhesive layer is configured to bond to a heat generating portion of a first component or a metal portion of a second component, so as to isolate the heat generating portion from the metal portion in an insulated manner.
Claims16
An insulation and heat-dissipation pad, comprising:
- a thermally conductive insulation film;
- and
- a thermosetting adhesive layer;
- wherein the thermosetting adhesive layer is pre-bonded to the thermally conductive insulation film, and the thermosetting adhesive layer is configured to bond to a heat generating portion of a first component or a metal portion of a second component, so as to isolate the heat generating portion from the metal portion in an insulated manner.
Dependencies are inferred from the claim text.