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US 6,210,522 B1Granted
Adhesive bonding laminates
AssigneeLexmark International, Inc.
InventorsJeanne Marie Saldanha Singh, Paul Timothy Spivey
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Abstract
An adhesive bonding laminate includes a first thermoplastic adhesive film that is capable of adhesively bonding to an epoxy coating and a second thermoset adhesive film that is capable of adhesively bonding to a passivated surface of a substrate. The first thermoplastic adhesive film is adhesively bonded to the second thermoset adhesive film. Ink jet printheads, ink jet print cartridges and methods of attaching a flexible circuit to substrate employ the adhesive bonding laminate.
Claims21
A method for attaching a flexible circuit to a substrate, comprising the steps of:
- providing a silicon chip electrically bonded to a flexible circuit, wherein the flexible circuit has an epoxy coating on one side thereof;
- providing a substrate with a passivated surface;
- providing the adhesive bonding laminate comprising a first thermoplastic adhesive film that is capable of bonding to an epoxy coating;
- and a second thermoset adhesive film that is capable of bonding to a passivated surface of a substrate;
- wherein the first adhesive film is adhesively bonded to the second adhesive film, wherein the adhesive bonding laminate comprises the first thermoplastic adhesive film on a first side and the second thermoset adhesive film on a second side;
- adhesively bonding the second side of the adhesive bonding laminate to the passivated surface of the substrate;
- adhesively bonding the silicon chip to the substrate surface;
- adhesively bonding the first side of the adhesive bonding laminate to the epoxy coated side of the flexible circuit.
5 more elements
Dependencies are inferred from the claim text.