C09J 2463/005
In the release coating
Official title: in the release coating
C09J2463/005 (In the release coating) appears on 10 US grants and 6 published applications in this corpus.
Search patents in C09J- Granted patents
- 10
- Published applications
- 6
- Assignees
- 7
- Inventors
- 17
- Latest grant
- 28 Jul 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 2 |
| 2019 | 1 | 0 |
| 2020 | 2 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 2 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Adhesive resin laminate, laminate, and method of producing same28 Jul 2020US 10,723,923 B2Fujimori Kogyo Co., Ltd.
- Adhesive resin laminate, laminate, and method of producing same17 Mar 2020US 10,590,317 B2Fujimori Kogyo Co., Ltd.
- First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip24 Dec 2019US 10,515,830 B2Lintec Corporation
- Release coating and barrier coating for linerless thermal labels and method of making7 May 2002US 6,383,631 B1The Standard Register Company
- Silicone release composition28 Apr 1992US 5,108,782 AP. H. Glatfelter Company
- Release agent composition for release by irradiation with light, laminate, and method for producing processed semiconductor substrate17 Sep 2026US 2026/0275170 A1Nissan Chemical Corporation
- Release agent composition for release by irradiation with light, laminate, and method for producing processed semiconductor substrate25 Dec 2025US 2025/0388785 A1Nissan Chemical Corporation
- Adhesive composition, laminate, method for producing laminate, and method for producing processed substrate20 Mar 2025US 2025/0092292 A1Nissan Chemical Corporation
- Adhesive resin laminate, laminate, and method of producing same4 Jun 2020US 2020/0172776 A1Fujimori Kogyo Co., Ltd.
- First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip8 Nov 2018US 2018/0323084 A1Lintec Corporation
Most cited
By later US patents
- Release coating and barrier coating for linerless thermal labels and method of making27US 6,383,631 B1The Standard Register Company · 2002
- Silicone release composition25US 5,108,782 AP. H. Glatfelter Company · 1992
- Method for making printable self-adhesive tapes and the self-adhesive tapes obtaned thereby18US 4,421,817 A1983
- Printable release-coating compositions and printing ink for pressure-sensitive adhesive tape11US 4,587,167 AVibac S.p.A. · 1986
- UV Curable compositions and substrates treated therewith10US 4,319,974 AGeneral Electric Company · 1982