C08L 63/04
Epoxynovolacs
C08L63/04 (Epoxynovolacs) appears on 286 US grants and 405 published applications in this corpus.
Search patents in C08L- Granted patents
- 286
- Published applications
- 405
- Assignees
- 190
- Inventors
- 1,041
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 7 | 0 |
| 2002 | 2 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 4 |
| 2005 | 2 | 2 |
| 2006 | 2 | 4 |
| 2007 | 1 | 2 |
| 2008 | 0 | 3 |
| 2009 | 0 | 5 |
| 2010 | 2 | 5 |
| 2011 | 1 | 11 |
| 2012 | 6 | 12 |
| 2013 | 10 | 26 |
| 2014 | 8 | 24 |
| 2015 | 10 | 27 |
| 2016 | 24 | 34 |
| 2017 | 23 | 35 |
| 2018 | 24 | 17 |
| 2019 | 15 | 29 |
| 2020 | 19 | 39 |
| 2021 | 21 | 36 |
| 2022 | 25 | 33 |
| 2023 | 18 | 18 |
| 2024 | 11 | 12 |
| 2025 | 19 | 14 |
| 2026 | 6 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low density flame retardant two-component composition for structural void filling15 Sep 2026US 12,735,527 B2Zephyros, Inc.
- Method for producing encapsulated structure and epoxy resin composition28 Jul 2026US 12,692,385 B2Sumitomo Bakelite Co., Ltd.
- Resin composition, resin cured product, and fiber reinforced resin14 Jul 2026US 12,679,925 B2Hitachi, Ltd.
- Resin composition, layered body including resin composition layer, layered body, flexible copper-clad laminate, flexible flat cable, and electromagnetic wave shielding film26 May 2026US 12,637,565 B2Toagosei Co., Ltd.
- Resin composition, cured product, sheet-like laminate material, resin sheet, printed wiring board, and semiconductor device5 May 2026US 12,617,986 B2Ajinomoto Co., Inc.
- Magnetic composition, magnetic film, stack, and circuit member1 Oct 2026US 2026/0297291 A1
- Epoxy resin compositioncomposition comprising the same3 Sep 2026US 2026/0258243 A1Kcc Corporation
- Epoxy resin composition for rtm, cured resin product and fiber-reinforced composite material, and manufacturing method therefor30 Jul 2026US 2026/0217903 A1Toray Industries, Inc.
- Chemical-resistant protective film9 Jul 2026US 2026/0193459 A1Nissan Chemical Corporation
- Powder coating composition25 Jun 2026US 2026/0176462 A1Kcc Corporation
Most cited
By later US patents
- Low flow, vacuum bag curable prepreg material for high performance composite systems48US 4,016,022 AThe United States of America as represented by the Secretary of the Air Force · 1977
- Composition of bulk filler and epoxy-clay nanocomposite30US 7,163,973 B2Henkel Corporation · 2007
- Method of making permselective interpolymer membranes27US 3,948,823 AAllied Chemical Corporation · 1976
- Hydrolytic stable glass fiber reinforced polyester resins22US 5,731,390 AGeneral Electric Company · 1998
- Resin-encapsulated semiconductor devices21US 4,985,751 AShin-Etsu Chemical Co., Ltd. · 1991