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US 12,637,565 B2Granted
Resin composition, layered body including resin composition layer, layered body, flexible copper-clad laminate, flexible flat cable, and electromagnetic wave shielding film
AssigneeToagosei Co., Ltd.
InventorsMasahiro Torii, Yuya Okimura, Hironori Kutsuna, Makoto Hirakawa, Masashi Yamada
Life of this patent
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Abstract
A resin composition including a polyester polyurethane resin (A); and an epoxy resin (B), in which a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to 8,000, and a layered body including a resin composition layer, a layered body, a flexible copper-clad laminate, a flexible flat cable, or an electromagnetic wave shielding film, each using the resin composition.
Claims15
A resin composition comprising:
- a polyester polyurethane resin (A);
- an epoxy resin (B), and
- a metal filler,
- wherein the metal filler is a conductive filler, and wherein a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to 8,000.
1 more element
Dependencies are inferred from the claim text.