Composition of bulk filler and epoxy-clay nanocomposite
AssigneeHenkel Corporation
InventorTanweer Ahsan
Life of this patent
Estimating the term…
Abstract
A molding composition or encapsulant for an electronic component and its method of preparation provides reduced moisture uptake without undue swelling and comprises melt-blending an epoxy resin, hardener and clay, cooling, adding a catalyst to form an epoxy-clay nano-composite, and combining it with a bulk amount of a filler.
Claims20
A molding composition comprising:
- a) a bulk amount of a filler component, and
- b) an epoxy-clay nano-composite comprising a melt-blended mixture of:
- i) an epoxy resin;
- ii) a resin hardener;
- and
- iii) clay.
A molding composition as in claim1, wherein said epoxy-clay nanocomposite further comprises a catalyst for promoting reaction between the epoxy resin and the hardener.
An electronic packaging material comprising a reaction product of a molding composition comprising a bulk amount of a filler component and an epoxy-clay nano-composite comprising a mixture of an epoxy-resin, a resin hardener, and clay.
An electronic package comprising an electronic component encapsulated with an encapsulant, said encapsulant comprising the reaction product of a bulk amount of a filler component and an epoxy-clay nano-composite comprising a mixture of an epoxy-resin, a resin hardener, and clay.
A molding composition comprising:
- a) about 50 weight percent to about 95 weight percent, based on the total weight of the composition, of a filler component, and
- b) about 5 weight percent to about 50 weight percent, based on the total weight of the composition, of an epoxy-clay nano-composite comprising a melt-blended mixture of:
- i) about 20 weight percent to about 75 weight percent, based on the weight of the epoxy-clay nano-composite, of an epoxy resin,
- ii) about 7.5 weight percent to about 50 weight percent, based on the weight of the epoxy-clay nano-composites of a resin hardener,
- iii) about 2.5 weight percent to about 15 weight percent, based on the weight of the epoxy-clay nano-composite of clay, and
- iv) optionally, about 0.5 weight percent to about 50 weight percent, based on the weight of the epoxy-clay nano-composite, of a catalyst for promoting reaction between the epoxy resin and the resin hardener.
A molding composition comprising a melt-blended epoxy-clay nano-composite and a bulk amount of a filler component, wherein the molding composition has a moisture uptake of less than about 0.33 percent after exposure to a temperature of about 85 C at about 85 percent relative humidity for a period of about 168 hours.
A method of preparing a molding composition comprising:
- a) preparing an epoxy-clay nano-composite by:
- i) melt-blending a mixture of an epoxy resin component, a resin hardener component and clay at a temperature capable of melting said epoxy resin component without causing polymerization of said epoxy resin component;
- ii) cooling said melt-blended mixture;
- iii) mixing said melt-blended mixture with a catalyst, optionally, a mold release agent and optionally, a coupling agent;
- and
- b) mixing said epoxy-clay nano-composite with a bulk amount of a filler material.
A method of reducing moisture uptake in highly filled epoxy molding compositions comprising mixing an epoxy resin component with a bulk amount of a filler material, wherein said epoxy resin component comprises an epoxy-clay nano-composite prepared from a melt-blended mixture of an epoxy resin, a resin hardener and clay.
Dependencies are inferred from the claim text.