C08G 8/28
Chemically modified polycondensates
C08G8/28 (Chemically modified polycondensates) appears on 621 US grants and 340 published applications in this corpus.
Search patents in C08G- Granted patents
- 621
- Published applications
- 340
- Assignees
- 293
- Inventors
- 1,310
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 15 | 0 |
| 1977 | 18 | 0 |
| 1978 | 21 | 0 |
| 1979 | 11 | 0 |
| 1980 | 15 | 0 |
| 1981 | 19 | 0 |
| 1982 | 13 | 0 |
| 1983 | 18 | 0 |
| 1984 | 11 | 0 |
| 1985 | 13 | 0 |
| 1986 | 11 | 0 |
| 1987 | 20 | 0 |
| 1988 | 7 | 0 |
| 1989 | 14 | 0 |
| 1990 | 11 | 0 |
| 1991 | 14 | 0 |
| 1992 | 19 | 0 |
| 1993 | 25 | 0 |
| 1994 | 16 | 0 |
| 1995 | 16 | 0 |
| 1996 | 12 | 0 |
| 1997 | 17 | 0 |
| 1998 | 9 | 0 |
| 1999 | 10 | 0 |
| 2000 | 15 | 0 |
| 2001 | 11 | 2 |
| 2002 | 16 | 9 |
| 2003 | 8 | 11 |
| 2004 | 7 | 16 |
| 2005 | 4 | 4 |
| 2006 | 6 | 11 |
| 2007 | 2 | 7 |
| 2008 | 4 | 6 |
| 2009 | 3 | 10 |
| 2010 | 7 | 4 |
| 2011 | 5 | 8 |
| 2012 | 5 | 15 |
| 2013 | 13 | 24 |
| 2014 | 12 | 15 |
| 2015 | 21 | 23 |
| 2016 | 15 | 32 |
| 2017 | 16 | 21 |
| 2018 | 23 | 15 |
| 2019 | 10 | 24 |
| 2020 | 15 | 17 |
| 2021 | 7 | 11 |
| 2022 | 11 | 16 |
| 2023 | 8 | 12 |
| 2024 | 12 | 10 |
| 2025 | 5 | 10 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resist underlayer compositions and pattern formation methods using such compositions11 Aug 2026US 12,704,778 B2Dupont Electronic Materials International, LLC
- Phenolic hydroxy group-containing resin, resin composition for alkaline developable resist, resist curable resin composition, and method for producing phenolic hydroxy group-containing resin16 Jun 2026US 12,655,242 B2DIC Corporation
- Lignin-based phenolic adhesives, related compositions, and related methods12 May 2026US 12,624,171 B2Board of Trustees of Michigan State University
- Curable resin, curable resin composition, and cured product21 Apr 2026US 12,606,655 B2DIC Corporation
- Resin, method for producing resin, curable resin composition, and cured product3 Feb 2026US 12,540,243 B2Mitsubishi Gas Chemical Company, Inc.
- Phosphorus-containing (meth)acryloyl compound, phosphorus-containing vinyl benzyl compound, production methods therefor, flame-retardant resin composition and laminated board for electronic circuit board containing same6 Aug 2026US 2026/0226082 A1Nippon Steel Chemical & Material Co., Ltd.
- Aralkyl resole polymer6 Aug 2026US 2026/0226296 A1
- Curable resin, curable resin composition, and cured product14 May 2026US 2026/0132242 A1DIC Corporation
- Epoxy resin, curable resin composition, and cured product30 Apr 2026US 2026/0117016 A1Nippon Kayaku Kabushiki Kaisha
- Curable resin composition and cured product thereof30 Apr 2026US 2026/0117017 A1Nippon Kayaku Kabushiki Kaisha
Most cited
By later US patents
- Coatable thermally curable binder presursor solutions modified with a reactive diluent, abrasive articles incorporating same, and methods of making said abrasive articles110US 5,178,646 AMinnesota Mining and Manufacturing Company · 1993
- Thermosetting phenolic resin composition75US 5,864,003 AGeorgia-Pacific Resins, Inc. · 1999
- Manufacturing methods for the production of carbon materials70US 8,293,818 B2EnerG2 Technologies, Inc. · 2012
- Flame resistant article made of phenolic triazine and related method using a pure cyanato novolac65US 4,988,780 AAllied-Signal Inc. · 1991
- Photosensitive compositions with reaction product of novolak co-condensate with o-quinone diazide64US 4,308,368 ADaicel Chemical Industries, Ltd. · 1981