Phenolic hydroxy group-containing resin, resin composition for alkaline developable resist, resist curable resin composition, and method for producing phenolic hydroxy group-containing resin
AssigneeDIC Corporation
InventorsTomoyuki Imada, Norio Nagae
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Abstract
Provided is a phenolic hydroxy group-containing resin having sufficient solubility in organic solvents, having excellent infiltratability into microscopic spaces because of having low viscosity and low polarity, and being capable of being used for ultrafine wiring pattern formation. Specifically, provided is a phenolic hydroxy group-containing resin containing one or more phenolic hydroxy group-containing compounds (1) selected from the group consisting of a compound (1) represented by Structural Formula (1) below and a compound (1′) represented by Structural Formula (1′) below.
Claims20
A phenolic hydroxy group-containing resin comprising one or more phenolic hydroxy group-containing compounds (1) selected from the group consisting of a compound (1) represented by Structural Formula (1) below and a compound (1′) represented by Structural Formula (1′) below:
- in the formula, R1's are each independently a hydrogen atom, an aliphatic hydrocarbon group, an alkoxy group, or a halogen atom;
- and n's are each independently an integer of 0 to 2;
- in the formula, R1's are each independently a hydrogen atom, an aliphatic hydrocarbon group, an alkoxy group, or a halogen atom;
- and n's are each independently an integer of 0 to 2.
Dependencies are inferred from the claim text.