Curable resin, curable resin composition, and cured product
AssigneeDIC Corporation
InventorsRyuichi MATSUOKA, Lichen YANG, Hiroyoshi KANNARI
Life of this patent
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AssigneeDIC Corporation
InventorsRyuichi MATSUOKA, Lichen YANG, Hiroyoshi KANNARI
Estimating the term…
A curable resin that can have excellent heat resistance (a high glass transition temperature) and dielectric properties (low dielectric properties), the curable resin composition, and its cured product. Specifically, a curable resin (A) contains both a structure represented by General Formula (1) below and a structure represented by General Formula (2) below. (In the afomentioned General Formula (1), the details of the substituents and the number of the substituents are as described in the present specification.) (In the afomentioned General Formula (2), the details of the substituents and the number of the substituents are as described in the present specification.)
A curable resin (A) comprising both a structure represented by General Formula (1) below and a structure represented by General Formula (2) below:
Dependencies are inferred from the claim text.