C08G 73/128
The unsaturated precursors containing heterocyclic moieties in the main chain
Official title: {the unsaturated precursors containing heterocyclic moieties in the main chain}
C08G73/128 (The unsaturated precursors containing heterocyclic moieties in the main chain) appears on 50 US grants and 70 published applications in this corpus.
Search patents in C08G- Granted patents
- 50
- Published applications
- 70
- Assignees
- 49
- Inventors
- 215
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 2 |
| 2015 | 2 | 0 |
| 2016 | 1 | 4 |
| 2017 | 2 | 6 |
| 2018 | 3 | 7 |
| 2019 | 2 | 3 |
| 2020 | 1 | 7 |
| 2021 | 6 | 13 |
| 2022 | 2 | 6 |
| 2023 | 4 | 4 |
| 2024 | 9 | 6 |
| 2025 | 3 | 8 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photosensitive resin composition and method for producing cured relief pattern28 Apr 2026US 12,613,465 B2Asahi Kasei Kabushiki Kaisha
- Resin composition and article made therefrom5 Aug 2025US 12,378,412 B2Elite Material Co., Ltd.
- Polyimide precursor resin composition for forming flexible device substrate17 Jun 2025US 12,330,981 B2Ube Corporation
- Additive manufacturing employing solvent-free polyimide-containing formulations6 May 2025US 12,291,603 B2Stratasys, Inc.
- Modified allyl compound, modified bismaleimide prepolymer12 Nov 2024US 12,139,582 B2Guangdong Hinno-Tech Co., Ltd.
- Heat-curable resin composition23 Apr 2026US 2026/0109860 A1Shin-Etsu Chemical Co., Ltd.
- Diels-alder crosslinked polyurethanes2 Apr 2026US 2026/0092145 A1The Government of the United States of America, as represented by the Secretary of the Navy
- Resin composition, diamine compound, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device1 Jan 2026US 2026/0003281 A1FUJIFILM Corporation
- Compound, composition, cured product, and method for producing compound11 Dec 2025US 2025/0376465 A1Mitsubishi Gas Chemical Company, Inc.
- Maleimide resin, resin composition, cured product, sheet, laminate, and printed wiring board4 Sep 2025US 2025/0277087 A1
Most cited
By later US patents
- High temperature three dimensional printing compositions65US 9,708,440 B2Novoset, LLC · 2017
- Polyimides having bis-maleimide terminal groups45US 4,418,181 APlastics Engineering Company · 1983
- High temperature three-dimensional printing compositions41US 9,873,761 B1Novoset, LLC · 2018
- Bis-(maleamic acid) derivatives of triamines34US 4,438,280 APlastics Engineering Company · 1984
- Triamino pyridine compounds20US 4,000,146 AHorizons Incorporated, a division of Horizons Research Incorporated · 1976