Heat-curable resin composition

A curable resin composition comprising:

• (A) a first cyclic imide resin represented by formula (1) defined as
• wherein, in the formula (1), each A independently represents a tetravalent organic group having a cyclic structure, each Q independently represents a divalent aliphatic hydrocarbon group having 6 or more carbon atoms and optionally containing heteroatom(s) or a dimer acid frame-derived divalent hydrocarbon group, each B independently represents an arylene group having 6 or more carbon atoms and optionally containing heteroatom(s), each X is a hydrogen atom or a methyl group, n1 is a number of 0 to 200 and m1 is a number of 0 to 200 provided that n1+m1 satisfies 21 to 400, and repeating units identified by n1 and m1 may be present in any order;
• (B) a second cyclic imide resin in an amount of 1 to 40 parts by mass per 100 parts by mass of the first cyclic imide resin (A), said second cyclic imide resin represented by formula (2) defined as
• wherein, in the formula (2), A, Q, B, and X are as defined above, n2 is a number of 0 to 10 and m2 is a number of 0 to 10 provided that n2+m2 satisfies 0 to 20, and repeating units identified by n2 and m2 may be present in any order;
• and
• (C) a curing catalyst in an amount of 0.01 to 10 parts by mass per 100 parts by mass of the first cyclic imide resin (A).