C08G 73/124
The unsaturated precursors containing oxygen in the form of ether bonds in
Official title: {the unsaturated precursors containing oxygen in the form of ether bonds in the main chain}
C08G73/124 (The unsaturated precursors containing oxygen in the form of ether bonds in) appears on 103 US grants and 75 published applications in this corpus.
Search patents in C08G- Granted patents
- 103
- Published applications
- 75
- Assignees
- 69
- Inventors
- 263
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 5 | 0 |
| 1991 | 10 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 3 | 3 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 2 |
| 2010 | 1 | 4 |
| 2011 | 0 | 1 |
| 2012 | 3 | 1 |
| 2013 | 1 | 4 |
| 2014 | 1 | 1 |
| 2015 | 3 | 0 |
| 2016 | 3 | 3 |
| 2017 | 1 | 4 |
| 2018 | 0 | 4 |
| 2019 | 2 | 2 |
| 2020 | 1 | 3 |
| 2021 | 1 | 3 |
| 2022 | 4 | 8 |
| 2023 | 3 | 9 |
| 2024 | 4 | 8 |
| 2025 | 6 | 5 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition and article made therefrom29 Sep 2026US 12,747,355 B2Elite Material Co., Ltd.
- Photosensitive polyimide compositions9 Jun 2026US 12,650,646 B2Promerus, LLC
- Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board19 May 2026US 12,630,715 B2Panasonic Intellectual Property Management Co., Ltd.
- Polyamide-imide block copolymers, preparation method thereof and polyamide-imide film comprising the same13 Jan 2026US 12,522,729 B2LG Chem.Ltd.
- Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device23 Dec 2025US 12,504,687 B2Arakawa Chemical Industries, Ltd.
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, semiconductor device, polyimide, manufacturing method for polyimide, and compound8 Oct 2026US 2026/0310076 A1FUJIFILM Corporation
- Thermosetting maleimide resin composition for stress-relief layer for glass-core substrate and printed wiring board including the same30 Jul 2026US 2026/0218021 A1Shin-Etsu Chemical Co., Ltd.
- Curable resin composition23 Jul 2026US 2026/0209565 A1Shin-Etsu Chemical Co., Ltd.
- Curable resin composition for solder resist use18 Jun 2026US 2026/0166660 A1Shin-Etsu Chemical Co., Ltd.
- Heat-curable resin composition23 Apr 2026US 2026/0109860 A1Shin-Etsu Chemical Co., Ltd.
Most cited
By later US patents
- Water-insoluble hydrophilic copolymers57US 4,277,582 ACiba-Geigy Corporation · 1981
- Compliant maleimide based plastics43US 4,116,937 ATRW Inc. · 1978
- Low temperature curable compliant bismaleimide compositions35US 4,179,551 ATRW Inc. · 1979
- Polyetherimides prepared by self-condensation of hydroxyaryl phthalimide salts32US 4,297,474 AGeneral Electric Company · 1981
- Curable aliphatic epoxy-polimide compositions27US 4,237,262 ATRW Inc. · 1980