C08G 59/4223
Aromatic
Official title: {aromatic}
C08G59/4223 (Aromatic) appears on 105 US grants and 90 published applications in this corpus.
Search patents in C08G- Granted patents
- 105
- Published applications
- 90
- Assignees
- 88
- Inventors
- 307
- Latest grant
- 16 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 5 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 7 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 3 |
| 2013 | 1 | 5 |
| 2014 | 2 | 8 |
| 2015 | 4 | 4 |
| 2016 | 2 | 2 |
| 2017 | 2 | 4 |
| 2018 | 1 | 6 |
| 2019 | 6 | 8 |
| 2020 | 5 | 11 |
| 2021 | 3 | 4 |
| 2022 | 3 | 6 |
| 2023 | 3 | 7 |
| 2024 | 3 | 6 |
| 2025 | 5 | 6 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Furanic diglycidyl ethers and esters and use thereof16 Dec 2025US 12,497,391 B2Braskem S/A
- Powder coating material2 Dec 2025US 12,486,407 B2Sumitomo Bakelite Co., Ltd.
- Softening agent for textiles, aqueous solution of softening agent for textiles and method for producing same, and textile and method for producing same27 May 2025US 12,312,739 B2Goulston Technologies, Inc.
- Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition25 Feb 2025US 12,234,318 B2Shengyi Technology Co., Ltd.
- Curable composition and fiber reinforced composite material21 Jan 2025US 12,202,929 B2DIC Corporation
- Heat-curing epoxy resin composition suitable for low curing temperature with good storage stability24 Sep 2026US 2026/0286039 A1Sika Technology AG
- Heat-curable composition, cured article, adhesive agent, and heat-curable composition production method4 Jun 2026US 2026/0152600 A1Kagoshima University
- Epoxy resin composition, resin paste, film-type adhesive, printed wiring board, semiconductor chip package, and electronic device23 Apr 2026US 2026/0109849 A1Asahi Kasei Kabushiki Kaisha
- Curing agent for epoxy resins, which curing agent has diphenolic acid19 Mar 2026US 2026/0078214 A1Sika Technology AG
- Methods, systems, devices and kits for formulating structural adhesives20 Nov 2025US 2025/0354037 A13M Innovative Properties Company
Most cited
By later US patents
- 4,4'-Isopropylidene-bis(3- and 4-phenyleneoxyphthalic anhydride)129US 3,972,902 AGeneral Electric Company · 1976
- Macromonomers having reactive side groups60US 5,869,592 AMaxdem Incorporated · 1999
- Radiation-sensitive polycondensates, processes for their preparation coated material and its use56US 4,694,061 ACiba-Geigy Corporation · 1987
- Aromatic bis(ether phthalis anhydride) compounds38US 3,956,320 AGeneral Electric Company · 1976
- Fluoro-anhydride curing agents and precursors thereof for fluorinated epoxy resins28US 4,045,408 AThe United States of America as represented by the Secretary of the Navy · 1977