C08G 59/3272
Containing phosphorus
Official title: {containing phosphorus}
C08G59/3272 (Containing phosphorus) appears on 26 US grants and 34 published applications in this corpus.
Search patents in C08G- Granted patents
- 26
- Published applications
- 34
- Assignees
- 21
- Inventors
- 73
- Latest grant
- 9 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 3 |
| 2012 | 1 | 2 |
| 2013 | 0 | 3 |
| 2014 | 2 | 3 |
| 2015 | 3 | 1 |
| 2016 | 1 | 1 |
| 2017 | 2 | 3 |
| 2018 | 2 | 3 |
| 2019 | 2 | 4 |
| 2020 | 4 | 2 |
| 2021 | 3 | 2 |
| 2022 | 1 | 3 |
| 2023 | 0 | 1 |
| 2024 | 2 | 0 |
| 2025 | 2 | 0 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Epoxy resin composition, prepreg and fiber-reinforced composite material9 Dec 2025US 12,492,285 B2Toray Industries, Inc.
- Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition25 Feb 2025US 12,234,318 B2Shengyi Technology Co., Ltd.
- Resin composition, method for forming cured product, and cured product20 Feb 2024US 11,905,388 B2Adeka Corporation
- Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same16 Jan 2024US 11,877,396 B2Mitsubishi Gas Chemical Company, Inc.
- Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminated plate, material for circuit board and cured product23 Aug 2022US 11,421,071 B2NIPPON STEEL Chemical & Materials Co., Ltd.
- Phosphonate epoxy thermosets27 Aug 2026US 2026/0250458 A1
- Hybrid impregnation process for electric vehicle motor stator using hot melt epoxy-imidazole cure system9 Jul 2026US 2026/0196901 A1
- Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition9 Feb 2023US 2023/0045615 A1Shengyi Technology Co., Ltd.
- Cationic Curing Composition for Plastic Substrate, Coating Material, Plastic Product and Application15 Dec 2022US 2022/0396677 A1Changzhou Green Photosensitive Materials Co., Ltd.
- Epoxy resin composition, prepreg and fiber-reinforced composite material24 Nov 2022US 2022/0372209 A1Toray Industries, Inc.
Most cited
By later US patents
- Prepreg and laminate13US 7,056,585 B2Mitsubishi Gas Chemical Company, Inc. · 2006
- Coating/sealant systems, aqueous resinous dispersions, and methods of electrocoating8US 9,181,628 B2PRC-DeSoto International, Inc. · 2015
- Resveratrol-based flame retardant materials1US 10,138,423 B1International Business Machines Corporation · 2018
- Levoglucosan-based flame retardant compounds1US 10,597,584 B2International Business Machines Corporation · 2020
- Monofunctional, bifunctional, and multifunctional phosphinated phenols and their derivatives and preparation method thereof1US 8,841,388 B2National Chung Hsing University · 2014