Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same

A laminate comprising a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order, wherein

• the first resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the first resin composition layer is to 5 μm;
• the second resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the second resin composition layer is 0.5 to 5 μm;
• the first resin composition layer is laminated onto the heat-resistant film layer by gravure coating using a first varnish comprising a first resin composition and a first solvent;
• the second resin composition layer is laminated onto the heat-resistant film layer by gravure coating using a second varnish comprising a second resin composition a second solvent;
• the first varnish and the second varnish are the same or different;
• the amount of the first solvent in the first varnish is in the range of 40 to 400% by mass based on 100% by mass of the first varnish;
• the amount of the second solvent in the second varnish is in the range of 40 to 400% by mass based on 100% by mass of the second varnish;
• and
• the first and second resin composition layers are formed via the gravure coating such that the first and second resin composition layers have a uniform thickness on both surfaces of the heat-resistant film layer.