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US 7,056,585 B2Granted
Prepreg and laminate
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsHiroyuki Mishima, Tsuyoshi Isozaki, Hidenori Kimbara, Norio Nagai
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Abstract
A prepreg comprising a thermosetting resin (D) composition containing, as an essential component, an aluminum hydroxide-boehmite composite (A) obtained by hydrothermal treatment of aluminum hydroxide, and a substrate (I), a laminate using the above prepreg, and a metal-foil-clad laminate using the above laminate.
Claims9
A prepreg for a printed wiring board material comprising
- a thermosetting resin (D) composition containing, as an essential component, an aluminum hydroxide-boehmite composite (A) obtained by hydrothermal treatment of aluminum hydroxide, boehmite (B), and a substrate (I), wherein the weight ratio of the aluminum hydroxide-boehmite composite (A) to boehmite (B) is in the range of from 45:55 to 95:5, and the weight ratio of aluminum hydroxide to boehmite in the aluminum hydroxide-boehmite composite (A) is in the range of from 45:55 to 95:5.
Dependencies are inferred from the claim text.