C08G 2170/00
Compositions for adhesives
C08G2170/00 (Compositions for adhesives) appears on 1,240 US grants and 1,484 published applications in this corpus.
Search patents in C08G- Granted patents
- 1,240
- Published applications
- 1,484
- Assignees
- 594
- Inventors
- 3,722
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 3 | 0 |
| 1978 | 6 | 0 |
| 1979 | 6 | 0 |
| 1980 | 5 | 0 |
| 1981 | 9 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 6 | 0 |
| 1985 | 8 | 0 |
| 1986 | 7 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 18 | 0 |
| 1990 | 9 | 0 |
| 1991 | 21 | 0 |
| 1992 | 23 | 0 |
| 1993 | 21 | 0 |
| 1994 | 22 | 0 |
| 1995 | 25 | 0 |
| 1996 | 23 | 0 |
| 1997 | 32 | 0 |
| 1998 | 35 | 0 |
| 1999 | 44 | 0 |
| 2000 | 21 | 0 |
| 2001 | 30 | 8 |
| 2002 | 20 | 20 |
| 2003 | 21 | 49 |
| 2004 | 19 | 47 |
| 2005 | 20 | 35 |
| 2006 | 24 | 33 |
| 2007 | 22 | 31 |
| 2008 | 14 | 28 |
| 2009 | 9 | 55 |
| 2010 | 19 | 34 |
| 2011 | 22 | 48 |
| 2012 | 19 | 68 |
| 2013 | 30 | 40 |
| 2014 | 33 | 51 |
| 2015 | 31 | 58 |
| 2016 | 30 | 51 |
| 2017 | 37 | 52 |
| 2018 | 41 | 65 |
| 2019 | 40 | 60 |
| 2020 | 49 | 79 |
| 2021 | 43 | 111 |
| 2022 | 40 | 128 |
| 2023 | 61 | 108 |
| 2024 | 66 | 98 |
| 2025 | 79 | 73 |
| 2026 | 46 | 54 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- C08G 2170/20Compositions for hot melt adhesivesIndexing code426
- C08G 2170/40Compositions for pressure-sensitive adhesivesIndexing code315
- C08G 2170/80Compositions for aqueous adhesivesIndexing code255
- C08G 2170/60Compositions for foamingIndexing code97
- C08G 2170/90Compositions for adhesives used in footwearIndexing code31
Recent patents
- Siloxane compound and formulations comprising said compound22 Sep 2026US 12,742,109 B2Evonik Operations GmbH
- Curing agent, adhesive composition for semiconductor comprising same, adhesive film for semiconductor, and semiconductor package using same15 Sep 2026US 12,735,528 B2LG Chem.Ltd.
- Heat-curable bismaleimide resin composition15 Sep 2026US 12,735,535 B2Shin-Etsu Chemical Co., Ltd.
- Curable silicone composition, cured product of same, and laminate15 Sep 2026US 12,735,536 B2Dow Toray Co., Ltd.
- Conductive polyaspartic ester based compositions8 Sep 2026US 12,729,263 B2Parker-Hannifin Corporation
- Foamable Polyurethane Composition Comprising a Fatty Amide8 Oct 2026US 2026/0308307 A1Henkel AG & Co. KGaA
- Polyesters and a process for preparing these polyesters8 Oct 2026US 2026/0308313 A1Evonik Operations GmbH
- Curable composition8 Oct 2026US 2026/0308378 A1Wacker Chemie AG
- Syntactic foam compositions1 Oct 2026US 2026/0297388 A1PRC-DeSoto International, Inc.
- Heat-curing epoxy resin composition suitable for low curing temperature with good storage stability24 Sep 2026US 2026/0286039 A1Sika Technology AG
Most cited
By later US patents
- Block copolymer, method of making the same, dimaine precursors of the same, method of making such diamines and end products comprising the block copolymer216US 5,214,119 AMinnesota Mining and Manufacturing Company · 1993
- Block copolymer, method of making the same, diamine precursors of the same, method of making such diamines and end products comprising the block copolymer190US 5,461,134 AMinnesota Mining and Manufacturing Company · 1995
- Electro-optic displays, and materials for use therein181US 7,173,752 B2E Ink Corporation · 2007
- Moisture-curing polyurethane hot-melt adhesive176US 5,932,680 AHenkel Kommanditgesellschaft auf Aktien · 1999
- Thermoplastic Elastomers175US 5,665,822 ALandec Corporation · 1997