Moisture-curing polyurethane hot-melt adhesive

A process for the production of a moisture-curing hot-melt adhesive composition, said process comprising reacting reactants comprised of:

• a) at least one aromatic polyisocyanate,
• b) at least one polyalkylene glycol at a concentration of more than 10%
• by weight based on total hot-melt adhesive, and
• c) only one polyester glycol having a glass transition temperature of from -40%.degree. C. to +50%.degree. C.;
• said reactants being characterized by the essential absence of polyalkylene polyols other than linear polyethers having two OH groups.

A moisture-curing polyurethane hot-melt adhesive composition comprising at least one polyurethane prepolymer, said polyurethane prepolymer being the reaction product of reactants comprising:

• a) from 15 to 35% by weight, based on the weight of the adhesive composition, of an aromatic polyisocyanate selected from the group consisting of toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, and mixtures thereof;
• b) from 10 to 70% by weight, based on the weight of the adhesive composition, of a polypropylene glycol having an average molecular weight of between 250 and 1,000;
• and
• c) from 5 to 65% by weight, based on the weight of the adhesive composition, of only one polyester glycol having a glass transition temperature of from -40.degree. C. to +50.degree. C., said polyester glycol having a molecular weight between 1,500 and 30,000;
• said reactants being characterized by the essential absence of polyalkylene polyols other than linear polyethers having two OH groups.