Curable silicone composition, cured product of same, and laminate

A curable silicone composition, comprising:

• (A) 100 parts by mass of organopolysiloxane resin containing the following components (A1) and (A2) at a mass ratio of from 20:80 to 90:10, where each of components (A1) and (A2) does not have hot-melt properties and is solid at 25° C.,
• (A1) an organopolysiloxane resin having a curing reactive functional group with a carbon-carbon double bond included in a molecule, and containing siloxane units expressed by SiO4/2 making up at least 20 mol % or more of all siloxane units, and
• (A2) an organopolysiloxane resin not having a curing reactive functional group with a carbon-carbon double bond included in a molecule, and containing a siloxane unit expressed by SiO4/2 making up at least 20 mol % or more of all siloxane units;
• (B) 10 to 100 parts by mass of a linear organopolysiloxane in a liquid state at 25° C., having a curing reactive functional group containing at least two carbon-carbon double bonds in a molecule;
• (C) an organohydrogen polysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, at an amount where the number of hydrogen atoms bonded to a silicon atom per one alkenyl group bonded to a silicon atom included in the entire composition is 0.5 to 20.0;
• and
• (D) a catalytic amount of a hydrosilylation reaction catalyst, which is inert at room temperature but activated in the composition after external energy stimulus;
• wherein the composition as a whole has hot-melt properties, and the melt viscosity, measured using a flow tester:
• outlet nozzle diameter 1 mm, pressure 2.5 MPa, at 100° C. is 50 Pa·s or less;
• and
• wherein component (A) has a mass loss ratio of 2.0 mass % or less when exposed to 200° C. for one hour.