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US 12,735,528 B2Granted
Curing agent, adhesive composition for semiconductor comprising same, adhesive film for semiconductor, and semiconductor package using same
AssigneeLG Chem, Ltd.
InventorsSeung Hee Nam, Kwang Joo Lee, Jung Hak Kim, Eun Byurl Cho, Young Sam Kim
Life of this patent
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Abstract
The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.
Claims19
A curing agent comprising at least one of a compound represented by the following Formula 1 and a compound represented by the following Formula 2:
- wherein R1, R2, R3 and R4 are each independently a phenolic group,
- n is an integer ranging from 1 to 50, and k is an integer ranging from 1 to 50, and
- wherein the phenolic group is monocyclic.
An adhesive composition for a semiconductor device containing:
- a thermosetting resin;
- a thermoplastic resin;
- and
- a curing agent comprising at least one of a compound represented by the following Formula 1 and a compound represented by the following Formula 2:
- wherein R1, R2, R3 and R4 are each independently a phenolic group,
- n is an integer ranging from 1 to 50, and k is an integer ranging from 1 to 50, and
- wherein the phenolic group is monocyclic.
4 more elements
Dependencies are inferred from the claim text.