C04B 41/5127
Cu
Official title: {Cu, e.g. Cu-CuO eutectic}
C04B41/5127 (Cu) appears on 90 US grants and 59 published applications in this corpus.
Search patents in C04B- Granted patents
- 90
- Published applications
- 59
- Assignees
- 75
- Inventors
- 258
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 6 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 3 |
| 2002 | 6 | 3 |
| 2003 | 3 | 4 |
| 2004 | 1 | 1 |
| 2005 | 4 | 4 |
| 2006 | 1 | 2 |
| 2007 | 1 | 2 |
| 2008 | 0 | 1 |
| 2009 | 1 | 2 |
| 2010 | 0 | 3 |
| 2011 | 0 | 2 |
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
| 2014 | 2 | 0 |
| 2015 | 0 | 2 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 3 |
| 2019 | 2 | 6 |
| 2020 | 4 | 2 |
| 2021 | 0 | 3 |
| 2022 | 4 | 1 |
| 2023 | 4 | 1 |
| 2024 | 1 | 3 |
| 2025 | 0 | 5 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copper-coated titanium diboride articles13 Jan 2026US 12,522,935 B2Alcoa USA Corp.
- Electronic component and method for producing same13 Feb 2024US 11,903,144 B2Material Concept, Inc.
- Method for producing a metal-ceramic substrate with electrically conductive vias31 Oct 2023US 11,804,383 B2Infineon Technologies AG
- Extrusion method for making a gaseous emissions treatment component29 Aug 2023US 11,738,309 B2Advanced Technology Emission Solutions Inc.
- Copper-ceramic composite21 Feb 2023US 11,584,696 B2Heraeus Deutschland GmbH & Co. KG
- Copper-coated titanium diboride articles16 Apr 2026US 2026/0103816 A1Alcoa USA Corp.
- Conductive substrate having high thermal conductivity27 Nov 2025US 2025/0361624 A1CMTEK Co., Ltd.
- Heat spreader, manufacturing method thereof, and porous carrier thereof27 Nov 2025US 2025/0362097 A1CMTEK Co., Ltd.
- Metal-ceramic composite5 Jun 2025US 2025/0178978 A1Heraeus Electronics GmbH & Co. KG
- Metal-ceramic composite5 Jun 2025US 2025/0183116 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- Method for making a ceramic multilayer structure having internal copper conductors56US 4,766,027 AE. I. Du Pont de Nemours and Company · 1988
- Control of the sintering of powdered metals45US 4,599,277 AInternational Business Machines Corporation · 1986
- Copper conductive composition for use on aluminum nitride substrate33US 5,165,986 AFerro Corporation · 1992
- Method for making a ceramic metal composite32US 5,735,332 ACoors Ceramics Company · 1998
- Metal-infiltrated ceramic seal32US 6,338,906 B12002