Method for producing a metal-ceramic substrate with electrically conductive vias

A method for producing a metal-ceramic substrate with a plurality of electrically conductive vias, the method comprising:

• attaching a first metal layer in a planar manner to a first surface side of a ceramic layer;
• after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into a plurality of holes in the ceramic layer, with each of the plurality of holes delimiting one of the plurality of electrically conductive vias, to form an assembly;
• converting the copper hydroxide or copper acetate brine into copper oxide;
• subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the plurality of holes;
• and
• after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side,
• wherein the copper body produces an electrically conductive connection between the first and the second metal layers.