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US 11,584,696 B2Granted
Copper-ceramic composite
AssigneeHeraeus Deutschland GmbH & Co. KG
InventorsKai Herbst, Christian Muschelknautz
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Abstract
A copper-ceramic composite: includes a ceramic substrate containing alumina and a copper or copper alloy coating on the ceramic substrate. The alumina has a mean grain shape factor Ra(Al2O3), defined as the arithmetic mean of the shape factors R of the alumina grains, of at least 0.4.
Claims12
A copper-ceramic composite comprising:
- a ceramic substrate containing grains of aluminum oxide, and
- a coating composed of copper or a copper alloy present on the ceramic substrate, wherein the grains of the aluminum oxide each have a maximum grain diameter dK,max, a grain diameter dK,ortho running perpendicular to dK,max, determined on half the length of dK,max, and a shape factor RK=dK,ortho/dK,max and the aluminum oxide has an average grain shape factor Ra(Al2O3), determined as arithmetic mean of the shape factors RK of the grains, of at least 0.8,
- wherein the coating composed of copper or a copper alloy is applied to the ceramic substrate by a direct copper bonding (DCB) process, the DCB process comprising:
- oxidizing a copper foil to form a copper oxide layer on the copper foil;
- laying the copper foil with the copper oxide layer on the ceramic substrate;
- heating the ceramic substrate and copper foil with the copper oxide layer to a temperature ranging from 1025° C. to 1083° C.;
- and
- cooling the heated ceramic substrate and copper foil with the copper oxide layer to room temperature.
5 more elements
Dependencies are inferred from the claim text.