C04B 37/021
In a direct manner
Official title: {in a direct manner, e.g. direct copper bonding [DCB]}
C04B37/021 (In a direct manner) appears on 394 US grants and 380 published applications in this corpus.
Search patents in C04B- Granted patents
- 394
- Published applications
- 380
- Assignees
- 215
- Inventors
- 979
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 12 | 0 |
| 1989 | 9 | 0 |
| 1990 | 10 | 0 |
| 1991 | 8 | 0 |
| 1992 | 11 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 7 | 0 |
| 1996 | 11 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 14 | 0 |
| 2000 | 10 | 0 |
| 2001 | 9 | 4 |
| 2002 | 11 | 12 |
| 2003 | 15 | 12 |
| 2004 | 7 | 9 |
| 2005 | 7 | 8 |
| 2006 | 4 | 5 |
| 2007 | 6 | 11 |
| 2008 | 4 | 6 |
| 2009 | 2 | 14 |
| 2010 | 8 | 8 |
| 2011 | 8 | 8 |
| 2012 | 4 | 15 |
| 2013 | 6 | 13 |
| 2014 | 10 | 16 |
| 2015 | 13 | 14 |
| 2016 | 12 | 24 |
| 2017 | 14 | 21 |
| 2018 | 8 | 15 |
| 2019 | 8 | 18 |
| 2020 | 16 | 20 |
| 2021 | 16 | 24 |
| 2022 | 9 | 18 |
| 2023 | 13 | 23 |
| 2024 | 20 | 20 |
| 2025 | 17 | 24 |
| 2026 | 13 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using a method of this type6 Oct 2026US 12,752,377 B2Rogers Germany GmbH
- Substrate structures and methods of manufacture6 Oct 2026US 12,757,319 B2Semiconductor Components Industries, LLC
- Composite ceramic substrate having multi-layer configuration29 Sep 2026US 12,747,191 B2Tong Hsing Electronic Industries, Ltd.
- Ceramic plate19 May 2026US 12,635,466 B2NGK Insulators, Ltd.
- Method of making a shaped tool component12 May 2026US 12,623,974 B2Element Six (UK) Limited
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Improved aluminum-containing nitride ceramic matrix composite, method of making, and method of use20 Aug 2026US 2026/0242660 A1SLT Technologies, Inc.
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248008 A1Heraeus Electronics GmbH & Co. KG
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248009 A1Heraeus Electronics GmbH & Co. KG
- Laser etched ceramic-containing material13 Aug 2026US 2026/0233339 A1Rtx Corporation
Most cited
By later US patents
- Composite abrasive compact having high thermal stability403US 5,127,923 AUS Synthetic Corporation · 1992
- Compact of boron-doped diamond and method for making same385US 4,268,276 AGeneral Electric Company · 1981
- Polycrystalline diamond cutters with working surfaces having varied wear resistance while maintaining impact strength334US 6,601,662 B2Grant Prideco, L.P. · 2003
- High volume density polycrystalline diamond with working surfaces depleted of catalyzing material316US 6,544,308 B2Camco International (UK) Limited · 2003
- Cutting element having composite formed of cemented carbide substrate and diamond layer and method of making same258US 4,784,023 ADiamant Boart-Stratabit (USA) Inc. · 1988